Anodized Metal Structure Manufacturing for Display Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional display manufacturing processes are complex and costly, with many steps required to produce displays such as micro light-emitting diode, mini light-emitting diode, and quantum dot light-emitting diode displays, necessitating the development of more efficient manufacturing methods.
Innovation Solution
A method of manufacturing a structure with anodized parts involves forming a bottom metal pattern with a dielectric layer on a substrate, followed by the sequential deposition of a semiconductor layer, multiple metal layers, and a mask layer. The process includes etching the second metal layer to expose the first metal layer, anodizing the first metal layer through the mask to form an anodized segment, and finally removing the mask layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional display manufacturing processes are used, then displays can be produced, but the manufacturing process is complex and costly with many steps required
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process. Specifically, the formation of the second metal layer, masking, etching to expose the first metal layer, and anodizing are merged into one continuous operation sequence, reducing the total number of discrete steps required in traditional manufacturing while maintaining production quality
Solution Approach 2:
The patent performs preliminary actions by forming the second metal layer and applying the mask layer before etching, so that the first metal layer is pre-exposed in specific patterns. This preliminary structuring allows the subsequent etching and anodizing steps to proceed more efficiently with fewer rework cycles, thereby reducing overall process complexity
2Ease of manufacture
If many manufacturing steps are used to produce displays, then quality can be controlled, but cost increases and efficiency decreases
Solution Approach 1:
The patent merges multiple previously separate manufacturing steps into a single integrated process flow. The formation of metal layers, masking, etching, and anodizing are combined into one continuous operation, reducing the total number of steps and associated costs while maintaining product quality through controlled process parameters
3Productivity
If traditional manufacturing steps are reduced, then cost and efficiency improve, but manufacturing precision must be maintained
Solution Approach 1:
The patent applies local quality by creating different exposure patterns of the first metal layer through selective etching of the second metal layer. The mask layer is designed with specific patterns that allow precise control over which regions of the first metal layer are exposed to the anodizing solution, ensuring that the anodized structure achieves the required manufacturing precision even with reduced process steps
Solution Approach 2:
The patent uses the mask layer as an intermediary element that controls the precision of the anodized structure. The mask layer is strategically positioned to expose only specific regions of the first metal layer to the anodizing solution, thereby maintaining manufacturing precision while reducing the overall number of manufacturing steps required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the number of manufacturing steps required, thereby decreasing costs and enhancing efficiency while producing structures with anodized parts for advanced display technologies.
Implementation Method 1
anodizing the first metal layer through the mask layer to form an anodized segment
Data Source
AI summary
A method of manufacturing a structure having anodized parts includes: forming a bottom metal pattern with a dielectric layer thereon on a substrate, in which the dielectric layer has an opening exposing the bottom metal pattern; forming a semiconductor layer to cover the dielectric layer; forming a first metal layer on the semiconductor layer; forming a second metal layer on the first metal layer; forming a mask layer on the second metal layer to expose a portion of a top surface of the second metal layer; etching the second metal layer through the mask layer until a top surface of the first metal layer is exposed, in which an etch selectivity of the second metal layer and the first metal layer is greater than 2.0; anodizing the first metal layer through the mask layer to form an anodized segment; and removing the mask layer.