Anodized Substrate Supporting Plate for Rear Surface Contamination
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Solution Overview
Problem
Contamination of semiconductor devices due to residual gases penetrating between the substrate and susceptor during thin film deposition processes, leading to device malfunction and reactor contamination.
Innovation Solution
A substrate supporting plate with an anodized edge portion and a central non-anodized area, featuring an insulating layer to prevent gas penetration and facilitate easy substrate unloading, combined with a thin film deposition apparatus design that includes a gas injection and control system to manage gas flow and minimize rear surface contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is mounted directly on the susceptor without an insulating layer, then good electrical contact is achieved, but gas penetrates between the substrate and susceptor causing contamination
Solution Approach 1:
The insulating layer is applied selectively only at the edge portion of the susceptor, not across the entire surface. This localized treatment prevents gas penetration at the critical edge region while maintaining electrical contact in the central mounting area, resolving the contradiction between preventing contamination and ensuring electrical contact.
2Object-affected harmful factors
If the entire susceptor surface is anodized with an insulating layer, then gas penetration is prevented, but substrate unloading becomes difficult due to strong adhesion
Solution Approach 1:
The anodized insulating layer is applied only to the edge portion of the susceptor rather than the entire surface. This localized approach prevents gas penetration at the edges where contamination occurs, while leaving the central mounting area free of insulating material, thereby maintaining easy substrate unloading without the complications of widespread adhesion.
3Object-affected harmful factors
If a complete insulating layer is applied on the susceptor, then contamination is prevented, but device complexity and manufacturing cost increase
Solution Approach 1:
Instead of applying an insulating layer across the entire susceptor surface, the invention applies the layer only to the edge portion where gas penetration and contamination problems occur. This selective local treatment prevents contamination effectively while minimizing the added complexity and manufacturing cost associated with complete surface coating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents gas deposition on the substrate rear surface, reducing contamination and facilitating easy substrate unloading, thereby improving device quality and yield.
Implementation Method 1
an edge portion of a top surface of the substrate mounting portion is anodized
Implementation Method 2
The insulating layer may include aluminum oxide
Data Source
AI summary
A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.