Anodizing Bubble Supply for Uniform Porous Substrate Layers

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Solution Overview

Problem

The formation of a porous layer on a substrate surface is hindered by bubbles adhering to the substrate during the anodizing process, leading to deteriorated in-plane uniformity and porosity of the porous layer.

Innovation Solution

A substrate processing apparatus is designed with a bubbler tube that supplies bubbles to the electrolytic solution to release adhering bubbles from the substrate surface, improving the uniformity and porosity of the porous layer by facilitating contact between the substrate and the electrolytic solution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If anodizing is performed in a liquid electrolytic solution, then a porous layer can be formed on the substrate surface, but bubbles adhere to the substrate surface and hinder porous layer formation

Engineering Contradiction:
Improvein-plane uniformity of porous layerVSAvoidbubble adhesion to substrate
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a gas supply mechanism that deliberately supplies gas bubbles to the substrate surface during anodizing. These supplied bubbles serve to displace and remove harmful adhering bubbles, converting the harmful effect of bubble adhesion into a beneficial cleaning action that improves porous layer uniformity

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent uses gas bubbles as an intermediary substance between the electrolytic solution and the substrate surface. The supplied bubbles act as a mediator to disrupt the adhesion of harmful bubbles and facilitate better contact between the electrolyte and substrate, thereby improving porous layer formation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If anodizing is performed in a liquid electrolytic solution, then a porous layer can be formed on the substrate surface, but bubbles adhere to the substrate and deteriorate porosity

Engineering Contradiction:
Improveporosity of porous layerVSAvoidbubble adhesion to substrate
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent converts the harmful effect of bubble adhesion into a beneficial effect by supplying controlled gas bubbles that actively remove adhering bubbles from the substrate surface during anodizing, thereby preserving the porosity of the formed porous layer

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent implements continuous gas supply during the anodizing process to maintain constant removal of adhering bubbles, ensuring uninterrupted and uniform porous layer formation with consistent porosity throughout the process

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively releases adhering bubbles, enhancing the in-plane uniformity and porosity of the porous layer, thereby improving the anodizing process outcomes.

Implementation Method 1

an anodizing apparatus that forms a porous layer on a surface of a substrate by an anodizing method

Methodology Applied
Scientific EffectAnodizing: Anodising

Implementation Method 2

an anode and a cathode configured to form a porous layer on a first surface of the first substrate

Methodology Applied
Scientific EffectElectrochemical reaction: Electrolysis

Implementation Method 3

a bubble supplier configured to supply a first bubble to the first surface of the first substrate

Methodology Applied
Scientific EffectBubble evolution: Bubble

Data Source

PatentUS20240312800A1Substrate processing apparatus and method for manufacturing semiconductor device
Publication Date: 2024.09.19 KIOXIA CORP
  • US20240312800A1 patent drawing
  • US20240312800A1 patent drawing
  • US20240312800A1 patent drawing

AI summary

A substrate processing apparatus includes a processing tank configured to accommodate a substrate processing liquid; a holder configured to place a first substrate in the processing tank; an anode and a cathode configured to form a porous layer on a first surface of the first substrate; and a bubble supplier configured to supply a first bubble to the first surface of the first substrate.