Antenna Package Air Cavity Surface Wave Suppression
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Solution Overview
Problem
Conventional wireless communications package structures for millimeter wave applications face challenges in implementing high-performance phased array antennas due to space constraints and the need for complex, costly packaging technologies that are lossy and utilize high dielectric constant materials, making it difficult to achieve efficient radiation characteristics.
Innovation Solution
The design incorporates an antenna package structure with a package carrier and a package cover that includes a planar lid with an array of planar antenna elements, bonded to the carrier with an air space in between, using a low dielectric constant medium to suppress surface waves and enhance radiation efficiency, eliminating the need for additional surface wave suppression structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging technologies are used for millimeter wave antenna packages, then high performance radiation characteristics can be achieved, but the package structure becomes complex and costly with high dielectric constant materials
Solution Approach 1:
The patent extracts the dielectric substrate material from the antenna package structure, replacing it with an air cavity. This eliminates the need for complex high dielectric constant materials while maintaining radiation performance, directly resolving the contradiction between reliability and device complexity
Solution Approach 2:
The patent changes the dielectric constant parameter from high values (conventional materials) to approximately 1 (air), fundamentally altering the electromagnetic properties of the package structure to achieve high performance with simplified design
2Reliability
If additional structures are added to suppress surface waves in phased array antenna packages, then radiation efficiency improves, but the available space is consumed
Solution Approach 1:
The patent removes the need for additional surface wave suppression structures by using an air cavity environment, which naturally suppresses surface waves. This resolves the space constraint issue while maintaining radiation efficiency
Solution Approach 2:
The air cavity environment self-suppresses surface waves through its inherent electromagnetic properties, eliminating the need for separate suppression structures. The system serves itself by using the air medium to naturally control surface wave propagation
3Volume of moving object
If compact integrated antenna systems are designed for millimeter wave applications, then size and cost are reduced, but maintaining high performance radiation characteristics becomes difficult
Solution Approach 1:
The patent merges the antenna elements, feed networks, and RFICs into a single integrated package with an air cavity environment. This combination achieves compact size while maintaining high performance radiation characteristics through the beneficial electromagnetic properties of air
Solution Approach 2:
By changing the dielectric environment to air, the patent enables compact integration while preserving radiation performance, as air's low dielectric constant and loss properties allow efficient electromagnetic wave propagation in small volumes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of compact, high-performance integrated antenna systems with improved radiation characteristics and reduced size and cost, suitable for millimeter wave frequencies, while preventing warpage and sagging of the antenna package cover.
Implementation Method 1
The package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier
Data Source
AI summary
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.