Antenna Power Divider Substrate With Air Layer for Lower Dielectric Loss
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Solution Overview
Problem
The increasing demand for efficient wireless data transmission in 5G communication systems requires antenna structures that minimize production costs while maintaining or improving radiation performance, particularly due to the higher frequency bands used.
Innovation Solution
The implementation of a substrate structure with an air layer in regions where the power divider is disposed, which includes a first dielectric layer with an air layer and a second dielectric layer between the first layer and the power divider, helps to reduce dielectric loss and enhance radiation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional substrate structure is used for antenna elements and power divider, then the structure is simple and easy to manufacture, but dielectric loss increases and radiation performance deteriorates
Solution Approach 1:
The substrate structure implements local quality by creating an air layer specifically in the region where the power divider is disposed, while maintaining dielectric layers in other regions. This localized modification reduces dielectric loss in the critical power divider area without requiring complete structural redesign, thereby improving radiation performance while controlling complexity
Solution Approach 2:
The substrate employs a composite structure combining air (zero dielectric constant) with dielectric materials (positive dielectric constant). This composite substrate configuration allows the power divider to operate in an low-loss environment while the dielectric layers provide necessary mechanical support and electrical isolation, achieving both low dielectric loss and structural integrity
2Reliability
If the number of antenna elements is increased for beamforming, then radiation performance improves, but production cost increases
Solution Approach 1:
The substrate structure is segmented into different regions: an air layer region where the power divider is disposed to minimize dielectric loss, and dielectric layer regions providing structural support. This segmentation allows optimized performance in critical areas while maintaining cost-effective manufacturing in other areas
Solution Approach 2:
The invention changes the dielectric parameter (permittivity) in the power divider region by introducing an air layer, effectively reducing dielectric loss. This parameter modification improves the quality factor and radiation efficiency of the antenna elements without requiring expensive materials or complex fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the fabrication of antenna structures at a lower cost while minimizing dielectric loss, thereby improving radiation performance and reducing transmission line losses by about 35% to 50% compared to conventional substrates.
Implementation Method 1
an air layer corresponding to the first region, and a second dielectric layer disposed between the first dielectric layer and the power divider
Data Source
AI summary
The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to an embodiment of the disclosure, an antenna structure of a wireless communication system may include: at least one antenna element including at least one antenna, a power divider configured to feed the at least one antenna element, and a substrate, the at least one antenna element and the power divider may be disposed on the substrate, and, the substrate may include a first dielectric layer having an air layer in a region corresponding to a first region in which the power divider is disposed on the substrate, and a second dielectric layer disposed between the first dielectric layer and the power divider.