Antenna Array Housing Layout for Multi-Band Beam Coverage

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Solution Overview

Problem

Next-generation wireless communication devices face challenges in achieving low latency and high-speed data communication due to limitations in network capacity, requiring advanced technologies like 5G and WiGIG, which demand innovative antenna array configurations to enhance beam coverage and minimize interference with existing communication devices.

Innovation Solution

The proposed solution involves a communication device with multiple antenna arrays arranged on a dielectric substrate, forming beams in specific directions and using phase-adjusted signals, integrated into an electronic device's housing to provide both low-frequency and high-frequency wireless communication capabilities without altering the device's design, thereby enhancing radiation performance and avoiding interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple antenna arrays are arranged on a dielectric substrate to provide beam coverage in next-generation wireless communication, then wireless communication performance in high frequency bands (20 GHz to 100 GHz) is improved, but interference with existing communication devices operating in lower frequency bands (500 MHz to 6000 MHz) may occur

Engineering Contradiction:
Improvewireless communication performanceVSAvoidinterference with existing communication devices
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The communication device is segmented into distinct functional modules: a first communication circuit for low-frequency bands (500 MHz to 6000 MHz) and a second communication circuit for high-frequency bands (20 GHz to 100 GHz), each with dedicated antenna arrays. This segmentation allows independent optimization and placement to minimize interference between frequency bands while maintaining overall device functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes three-dimensional spatial arrangement by placing the high-frequency antenna array on a dielectric substrate positioned at a corner of the housing, away from the low-frequency communication circuit. This spatial separation in multiple dimensions (distance, orientation, and positioning) reduces electromagnetic interference while maintaining beam coverage effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the communication device is integrated into the electronic device housing with specific antenna array configurations, then radiation performance is enhanced, but device design complexity increases

Engineering Contradiction:
Improveradiation performanceVSAvoiddevice design
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The dielectric substrate serves multiple functions simultaneously: it acts as a mounting platform for the high-frequency antenna array, provides electromagnetic shielding between frequency bands, serves as a structural component of the housing, and enables thermal management. This multi-functionality reduces the need for additional separate components, thereby managing design complexity while enhancing radiation performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the antenna array mounting structure with the device housing itself, where the dielectric substrate becomes an integral part of the housing architecture. By combining what would traditionally be separate components (antenna mounting structure and housing) into a unified design, the patent simplifies overall device complexity while maintaining enhanced radiation performance.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If antenna arrays are arranged to provide beam coverage in specific directions, then communication reliability is improved, but the area occupied by antenna structures increases

Engineering Contradiction:
Improvebeam coverageVSAvoidantenna structure area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent employs phased array technology with multiple antenna elements arranged in a curved or spherical geometry on the dielectric substrate, enabling beam forming and steering in three-dimensional space. This curved arrangement allows coverage of a wider solid angle with fewer elements compared to planar arrays, reducing the required area while maintaining beam coverage reliability.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for efficient wireless communication across various frequency bands from 500 MHz to 100 GHz, maintaining optimal beam patterns and radiation performance without design changes, thus addressing the limitations of existing technologies in network capacity and interference.

Implementation Method 1

a communication device with multiple antenna arrays arranged on a dielectric substrate, forming beams in specific directions and using phase-adjusted signals

Methodology Applied
Scientific EffectPhase adjustment:

Implementation Method 2

multiple antenna arrays arranged on a dielectric substrate

Methodology Applied
Scientific EffectDielectric: Dielectric

Data Source

PatentUS11757174B2Arrangement structure for communication device and electronic device including the same
Publication Date: 2023.09.12 SAMSUNG ELECTRONICS CO LTD
  • US11757174B2 patent drawing
  • US11757174B2 patent drawing
  • US11757174B2 patent drawing

AI summary

According to various embodiments, an electronic device includes a housing including a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.