Antenna Array Integrated in Metal Case for 5G Thermal Management

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Solution Overview

Problem

The existing antenna apparatuses for 5G communication systems face challenges in reducing heat generation, improving antenna radiation efficiency, and minimizing transmission insertion loss, especially due to the limitations imposed by the metal case of electronic devices and the high insertion loss in feed lines at super-high frequency bands like 28 GHz.

Innovation Solution

An antenna apparatus is designed with an array antenna integrated into the metal case of an electronic device, featuring multiple antenna elements with slot-shaped radiation parts and a heat dissipation system that includes a metal case connection member to dissipate heat directly, along with an RF module that uses aperture feeding or direct feeding to connect the feed lines efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an array antenna is integrated into the metal case with slot-shaped radiation parts, then antenna radiation efficiency is improved, but heat dissipation becomes more difficult

Engineering Contradiction:
Improveantenna radiation efficiencyVSAvoidheat generation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The metal case is segmented to include dedicated heat dissipation structures (heat dissipation fins or heat dissipation holes) separate from the antenna radiation slots. This allows the antenna elements to maintain their radiation efficiency while the heat dissipation structures provide thermal management pathways, resolving the contradiction between radiation efficiency and heat dissipation.

Inventive Principle:
Principle #1Segmentation

2Reliability

If feed lines are used to connect RFIC and power amplifier at 28 GHz, then signal transmission is achieved, but insertion loss increases significantly

Engineering Contradiction:
Improvesignal transmissionVSAvoidinsertion loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The feed lines are integrated directly into the metal case structure rather than being separate components. The metal case itself serves as the transmission path, with conductive traces or embedded feed lines that reduce the number of interfaces and connections. This merging approach minimizes insertion loss by eliminating multiple connection points and reducing the overall transmission path length at the sensitive 28 GHz frequency.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If multiple feed lines are added for MIMO antenna apparatus, then communication capacity is improved, but substrate lamination complexity increases

Engineering Contradiction:
ImproveMIMO communication capacityVSAvoidsubstrate lamination
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The metal case serves multiple functions simultaneously: it acts as the antenna radiation structure, the feed line transmission medium, and the heat dissipation component. The same conductive structures in the metal case provide both antenna elements and feed lines for multiple MIMO channels, eliminating the need for separate substrate laminations for each feed line and reducing overall device complexity while maintaining MIMO capacity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces heat generation, enhances antenna radiation efficiency, and improves transmission insertion loss by integrating the array antenna with the metal case and optimizing the feed line connections, leading to improved communication performance and bandwidth.

Implementation Method 1

a metal case connection member connecting the RF module and the metal case and dissipating heat of the antenna element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11145949B2Antenna apparatus and electronic device comprising same
Publication Date: 2021.10.12 SAMSUNG ELECTRONICS CO LTD
  • US11145949B2 patent drawing
  • US11145949B2 patent drawing
  • US11145949B2 patent drawing

AI summary

The present invention relates to an antenna apparatus and an electronic device comprising the same. The antenna apparatus according to one embodiment of the present invention comprises an array antenna formed on a metal case of an electronic device, wherein the array antenna comprises at least two antenna elements, the at least two antenna elements may operate in the same frequency band. According to one embodiment of the present invention, it is possible to provide an antenna apparatus capable of reducing heat generation and increasing the radiation efficiency of an antenna.