Multi-Module Antenna Array Layout for Higher mmWave EIRP

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Solution Overview

Problem

Existing wireless communication devices face challenges in achieving high output and wide communication radius within limited space due to limited antenna space and interference from adjacent components, particularly in high frequency bands like millimeter waves.

Innovation Solution

The implementation of a dual-polarization antenna array with multiple feed points connected through differential signals, utilizing a Radio Frequency Integrated Circuit (RFIC) chip and multiple antenna modules, each with distinct feed point configurations, to enhance transmission power and reduce signal attenuation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a single antenna module is used in limited space, then device size is reduced, but transmission power and signal coverage deteriorate

Engineering Contradiction:
Improvedevice sizeVSAvoidtransmission power
Core Design Contradiction:
Volume of moving objectVSPower

Solution Approach 1:

The antenna system is divided into multiple antenna modules, each with distinct feed point configurations. This segmentation allows each module to contribute to the overall transmission power while maintaining a compact device form factor, resolving the contradiction between small size and high power output.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple antenna modules are combined to form an antenna array that achieves doubled Effective Isotropic Radiated Power (EIRP). The merging of multiple modules' contributions enables high transmission power and wide signal coverage within limited device space.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If antenna space is limited, then device compactness is improved, but communication radius and signal coverage deteriorate

Engineering Contradiction:
Improvedevice compactnessVSAvoidcommunication radius
Core Design Contradiction:
Volume of moving objectVSLength of moving object

Solution Approach 1:

The patent transitions from a single antenna module to a multi-module array configuration, effectively utilizing spatial dimensions within the device. This dimensional expansion enables wider beam coverage and extended communication radius without increasing the device's external dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Power

If multiple antenna modules are used to increase power, then transmission power is improved, but device complexity increases

Engineering Contradiction:
ImproveEffective Isotropic Radiated PowerVSAvoidantenna configuration complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

Each antenna module is designed with universal functionality to support multiple frequency bands and dual polarization. This multi-functionality reduces overall system complexity by using standardized modules rather than requiring different specialized components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes parameter changes in feed point configurations across different antenna modules to achieve doubled EIRP. By varying the number and arrangement of feed points rather than changing the fundamental module structure, the system achieves higher power with minimal increase in complexity.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12592472B2Electronic device
Publication Date: 2026.03.31 SAMSUNG ELECTRONICS CO LTD
  • US12592472B2 patent drawing
  • US12592472B2 patent drawing
  • US12592472B2 patent drawing

AI summary

An electronic device includes a Radio Frequency Integrated Circuit (RFIC) chip, a first antenna module including a plurality of feed points electrically connected to the RFIC chip through a first feed line, and a second antenna module apart from the first antenna module. The second antenna module includes a plurality of feed points electrically connected to the RFIC chip through a second feed line, and a number of the plurality of feed points of the first antenna module is different from a number of the plurality of feed points of the second antenna module.