Antenna Array Module Thermal Management via Layered Dielectric Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antenna array modules face challenges in heat dissipation due to structural and material limitations, affecting their performance and radiation gain in 5G wireless network systems.
Innovation Solution
The design includes a circuit layer with a signal line and ground layer, an antenna dielectric layer with lower thermal conductivity, and a metal plate coupled via a coupling slot, along with lateral cooling electrodes to enhance heat dissipation and antenna gain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing antenna array module structures are used, then manufacturing and assembly are straightforward, but heat dissipation is insufficient affecting performance
Solution Approach 1:
The patent divides the antenna array module into distinct functional layers: a circuit layer for signal processing, an antenna dielectric layer for electromagnetic wave transmission, and a metal plate for heat dissipation. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall system performance.
Solution Approach 2:
The patent employs a composite structure combining different materials with complementary properties: a circuit layer with specific dielectric properties, an antenna dielectric layer with optimized thermal and electromagnetic characteristics, and a metal plate with high thermal conductivity. This composite approach enables simultaneous achievement of electrical performance and thermal management.
2Temperature
If antenna materials with high thermal conductivity are used, then heat dissipation improves, but radiation gain decreases due to material limitations
Solution Approach 1:
The patent extracts the heat dissipation function from the antenna radiating elements by introducing a separate metal plate dedicated to thermal management. This allows the antenna materials to be optimized for radiation gain while the metal plate handles heat dissipation, eliminating the tradeoff between these two functions.
Solution Approach 2:
The patent applies different material properties to different regions: the antenna dielectric layer uses materials with optimized electromagnetic properties for radiation, while the metal plate uses high thermal conductivity materials for heat dissipation. This local optimization allows each component to perform its specific function at peak efficiency.
3Temperature
If existing single-layer dielectric structures are used, then manufacturing is simple, but thermal management and antenna performance cannot be simultaneously optimized
Solution Approach 1:
The patent transitions from a single-layer dielectric structure to a multi-layer stacked structure, adding the vertical dimension of layering to enable independent optimization of thermal and electromagnetic properties. Each layer can be designed and manufactured separately using standard PCB and antenna fabrication techniques, maintaining ease of manufacture while achieving superior performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation and antenna performance, achieving better thermal management and radiation efficiency for 5G small cells.
Implementation Method 1
the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material
Data Source
AI summary
An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.