Antenna Array Package Sub-Pattern Interface Design
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Solution Overview
Problem
Existing wireless communication system packaging methods either require high upfront design and manufacturing costs for custom single packages or compromise on antenna uniformity and precision with modular packaging, leading to reduced performance.
Innovation Solution
The use of an antenna array package structure with sub-pattern interface packages and a package cover, where each sub-pattern interface package is electrically and mechanically coupled to a package carrier, allowing for flexible configuration and mounting on a host circuit via BGA or LGA, while maintaining uniformity and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single custom package is created for each antenna configuration, then antenna performance and precision are improved, but design costs and manufacturing complexity increase
Solution Approach 1:
The antenna array package is divided into multiple sub-pattern interface packages, each containing a subset of antenna elements. These modular sub-packages can be independently designed and manufactured, then assembled into different configurations by selecting and arranging specific sub-packages. This segmentation allows standardization of sub-packages while achieving custom antenna configurations through different assembly patterns.
2Ease of manufacture
If modular packaging is used, then design costs and manufacturing complexity are reduced, but antenna element uniformity and placement precision degrade
Solution Approach 1:
The sub-pattern interface packages are designed with universal standardized interfaces and consistent electrical characteristics. Each sub-package uses identical connection protocols, signal routing patterns, and mounting geometries. This universality allows different sub-packages to be interchangeably assembled into various antenna configurations while maintaining uniform performance characteristics and placement precision across all antenna elements.
3Adaptability or versatility
If modular sub-pattern interface packages are used, then inventory costs and design flexibility are improved, but package assembly complexity increases
Solution Approach 1:
Multiple sub-pattern interface packages are merged into a single integrated antenna array package through standardized mating surfaces and interconnection interfaces. The modular sub-packages are designed to be assembled into a complete antenna array that functions as a unified system, with consistent signal routing and coordinated phase relationships across all antenna elements. This merging approach maintains configuration flexibility while simplifying the overall assembly process through standardized interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces upfront design, manufacturing rework, and inventory costs without degrading antenna performance, enabling cost-effective and precise integration of large antenna arrays in wireless communication systems.
Implementation Method 1
The sub-pattern integrated circuit may be flip-chip bonded to the package carrier
Implementation Method 2
the antenna array package may be mounted on the host circuit via a ball grid array (BGA) or a land grid array (LGA) socket
Implementation Method 3
the host circuit comprises one or more heat sinks that are thermally connected to the plurality of sub-pattern integrated circuits via a plurality of thermal conduits
Data Source
AI summary
An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.