Substrate-Integrated Antenna Assembly for Connector-Free RF Feeding

The patent merges the connector structure with the substrate itself by designing the signal source substrate and feeding substrate with integrated connection structures. The signal source substrate includes a first connection structure with contact pads, and the feeding substrate includes a second connection structure that directly interfaces with it, eliminating the need for separate special connectors. This integration reduces assembly complexity while maintaining connection reliability through direct substrate-to-substrate coupling.

The substrates are designed with multi-functional connection structures that serve both as structural support and electrical connection interfaces. The first and second connection structures on the substrates simultaneously provide mechanical alignment, structural bonding surfaces, and electrical signal transmission paths, replacing the specialized single-function connectors with universal substrate-integrated connection structures.

The connection function is merged into the substrate manufacturing process itself. The first and second connection structures are formed as integral parts of the signal source substrate and feeding substrate during PCB fabrication, using standard industry processes for creating connection pads and traces. This eliminates the need for separate connector components and their associated procurement, inventory, and assembly costs.

The substrates are designed to be self-connecting through their inherent structural features. The first connection structure on the signal source substrate and the second connection structure on the feeding substrate are configured to automatically align and interface with each other when the substrates are positioned together, providing self-aligned connection stability without requiring additional connector components or complex assembly procedures.

The patent extracts the soldering process from the assembly procedure by eliminating the need for separate connectors that would require soldering. Instead, the electrical connections are established through direct substrate-to-substrate interfacing using the integrated first and second connection structures, which can be connected through reflow soldering of integrated circuitry or through mechanical compression connections, eliminating the need for manual or automated soldering operations on discrete connectors.

The patent replaces the mechanical soldering process with alternative connection methods. The first and second connection structures are designed to establish electrical connections through methods such as reflow soldering of surface-mount components, conductive adhesive bonding, or compression contact mechanisms, substituting the traditional soldering-of-connectors process with more easily performed and maintained connection techniques.

The patent applies local quality optimization at the connection interface between substrates. The first and second connection structures are designed with specific local geometric features, trace width variations, and grounding arrangements that are tailored to maintain characteristic impedance continuity at the interface. This localized impedance control at the connection point ensures signal transmission quality while maintaining overall assembly simplicity.

The connection structures incorporate controlled impedance parameters through specific design choices in trace geometry, substrate material selection, and ground plane configuration. By adjusting parameters such as trace width, spacing, and dielectric thickness in the first and second connection structures, the design maintains impedance matching across the substrate interface, ensuring signal integrity while keeping the assembly process simple.