Antenna Assistant Device with Multi-Layer PCB for Slim Electronics
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Solution Overview
Problem
Existing antenna devices in electronic devices face challenges in achieving high performance while maintaining a slim design due to physical elements required for antenna performance and static electricity protection, which restricts spatial flexibility.
Innovation Solution
The implementation of an antenna assistant device with a simplified structure, featuring a multi-layered printed circuit board with conductive patterns forming capacitance and inductance, and a capacitor structure with a floating metal layer between the capacitor and inductor structures, allowing for improved antenna performance and reduced static electricity interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical elements are added to secure antenna performance and prevent static electricity, then antenna performance and static electricity protection are improved, but device thickness increases
Solution Approach 1:
The patent combines the antenna assistant device with the existing PCB structure by integrating conductive patterns directly into the PCB layers. The capacitor structure uses capacitor substrates that are stacked and electrically connected to the antenna, while the inductor structure is disposed at lower or upper portions of the capacitor structure, all within the same space where a traditional separate antenna assistant device would be placed. This merging approach provides antenna performance enhancement and static electricity protection without requiring additional external components that would increase device thickness.
Solution Approach 2:
The patent implements a nested structure where the inductor structure is disposed at lower or upper portions of the capacitor structure, and a floating metal layer is positioned between them. The capacitor substrates are stacked with electrical connections through multiple layers. This nested arrangement allows multiple functional elements (capacitor, inductor, floating metal layer) to occupy overlapping or adjacent spatial regions, maximizing space utilization and preventing device thickness increase while maintaining all required functions.
2Reliability
If physical elements are added to secure antenna performance and prevent static electricity, then static electricity protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the static electricity protection function into the same integrated structure that provides antenna performance enhancement. The capacitor structure with stacked capacitor substrates, the inductor structure, and the floating metal layer work together as a unified antenna assistant device. This single integrated structure simultaneously provides both antenna performance improvement and static electricity protection, eliminating the need for separate protection circuits and reducing overall device complexity compared to using multiple independent components.
Solution Approach 2:
The antenna assistant device structure serves multiple functions simultaneously: the capacitor structure and inductor structure provide antenna performance enhancement, while the same structure also provides static electricity protection. The floating metal layer contributes to both antenna resonance characteristics and electrostatic discharge protection. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity while maintaining comprehensive protection and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a slim electronic device with enhanced antenna performance, expanded bandwidth, and effective static electricity protection, maintaining high efficiency in signal transmission and reception.
Implementation Method 1
a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance
Implementation Method 2
a second conductive pattern disposed in at least another one of the plurality of layers of the multi-layered printed circuit board to form an inductance
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.