Multi-Layer Antenna Module for Wider Bandwidth and Heat Reliability
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Solution Overview
Problem
Conventional patch antenna modules have limited impedance bandwidth and are affected by heat generated from connected chips, which compromises reliability and lifespan.
Innovation Solution
The antenna module design includes multiple dielectric layers with varying dielectric constants and thicknesses, along with specific radiator and conductor configurations, to enhance bandwidth and maintain reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional two-layer dielectric structure is used, then device complexity is low, but impedance bandwidth is limited to less than 5%
Solution Approach 1:
The patent divides the dielectric structure into three separate layers (first, second, and third dielectric layers) with different dielectric constants, where each layer serves a specific function in expanding the impedance bandwidth. The first dielectric layer (εr1) provides base support, the second dielectric layer (εr2) with lower constant expands bandwidth, and the third dielectric layer (εr3) with intermediate constant further optimizes the bandwidth to achieve over 5% impedance bandwidth.
Solution Approach 2:
The patent applies different dielectric constants to different spatial locations and layers: the first dielectric layer has a higher dielectric constant (εr1), the second has a lower dielectric constant (εr2 < εr1), and the third has an intermediate dielectric constant (εr3 where εr2 < εr3 < εr1). This local variation in dielectric properties optimizes the electromagnetic field distribution across different regions to expand impedance bandwidth.
2Adaptability or versatility
If chips (such as beamformer ICs) are connected to the antenna module, then functionality is enhanced, but heat generated by chips affects reliability and lifespan
Solution Approach 1:
The patent introduces a third dielectric layer with intermediate dielectric constant (εr3 where εr2 < εr3 < εr1) positioned between the second and third radiators. This intermediate layer acts as a thermal and electromagnetic buffer that isolates the antenna elements from heat generated by connected chips, thereby maintaining reliability while supporting chip integration.
Solution Approach 2:
The patent uses a composite dielectric structure combining three different dielectric materials with varying constants (εr1, εr2, εr3) to create a multi-functional layering that simultaneously provides electromagnetic performance optimization and thermal management capabilities, protecting the antenna module from heat-induced reliability issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced design achieves a 33% increase in bandwidth and maintains good reliability, even when connected to heat-generating components like beamformer ICs.
Implementation Method 1
The first dielectric layer has a first dielectric constant, the second dielectric layer has a second dielectric constant, and the third dielectric layer has a third dielectric constant, wherein the first dielectric constant is greater than the third dielectric constant, and the third dielectric constant is greater than the second dielectric constant
Data Source
AI summary
An antenna module is provided. The antenna module is adapted to transmit a wireless signal. The antenna module includes a first dielectric layer, a ground layer, a first radiator, a feed conductor, a second dielectric layer, a second radiator and a third dielectric layer. The first dielectric layer includes a first surface and a second surface. The ground layer is disposed on the first surface. The first radiator is disposed on the second surface. The feed conductor is coupled to the first radiator. The second dielectric layer includes a third surface and a fourth surface, wherein the second dielectric layer covers the first radiator, and the third surface contacts the first radiator and the second surface. The second radiator is disposed on the fourth surface. The third dielectric layer is disposed on the fourth surface and covers the second radiator.