Distributed Antenna Beam Combining With Single-SiP Beam Steering

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Solution Overview

Problem

The increasing complexity and cost of network devices due to the need for multiple RFIC chips and additional components to coordinate operations of antenna arrays, particularly in advanced wireless communication systems, are not adequately addressed by existing technologies.

Innovation Solution

Implementing a single system-in-package (SiP) module to steer beams across multiple antenna arrays, reducing the need for multiple RFIC chips and simplifying the coordination of antenna array operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple RFIC chips are used to control antenna arrays, then beam steering capability is improved, but device complexity and cost increase

Engineering Contradiction:
Improvebeam steering capabilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple RFIC chip functions into a single integrated SiP module that can control multiple antenna arrays. This integration maintains the beam steering capability while reducing the number of discrete components, thereby lowering device complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The SiP module is designed with universal functionality to control multiple antenna arrays simultaneously. A single SiP module can perform the functions previously requiring multiple separate RFIC chips, enabling one component to serve multiple purposes and reduce overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple RFIC chips are used to control antenna arrays, then beam steering capability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvebeam steering capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By merging multiple RFIC chip functions into a single SiP module, the patent reduces the total component count and assembly complexity. This integration lowers manufacturing costs through reduced bill of materials and simplified assembly processes while preserving beam steering functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The universal SiP module design allows a single component to replace multiple specialized RFIC chips, reducing per-unit costs through economies of scale and simplified supply chain management.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If multiple RFIC chips are used to coordinate antenna arrays, then beam steering precision is improved, but failure rate increases

Engineering Contradiction:
Improvebeam steering precisionVSAvoidfailure rate
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent integrates multiple RFIC chip functions into a single SiP module with centralized control logic. This unified architecture reduces the number of inter-chip connections and synchronization points, thereby reducing potential failure points while maintaining beam steering precision through integrated phase and amplitude control.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The SiP module incorporates feedback mechanisms that monitor and adjust beam steering operations across multiple antenna arrays in real-time. This centralized feedback control ensures precise beam steering while enabling rapid detection and compensation of any failures, thereby improving overall system reliability.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS20250280301A1Beam combining in distributed antenna arrays
Publication Date: 2025.09.04 QUALCOMM INC
  • US20250280301A1 patent drawing
  • US20250280301A1 patent drawing
  • US20250280301A1 patent drawing

AI summary

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit a capability indication indicating a capability for steering beams across two or more antenna arrays. The capability indication may further indicate that each of the beams is associated with one of the two or more antenna arrays, and that the beams of the two or more antenna arrays are steered by a single system-in-package (SiP) module. The UE may receive signals via the beams of the two or more antenna arrays. Numerous other aspects are described.