Antenna Device With Bending Connection For Thin Displays

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Solution Overview

Problem

In thin and lightweight display devices, the limited space poses a challenge for implementing high-frequency and broadband signal transmission and reception, as traditional antenna structures can increase thickness and cause mutual interference with other pixel or sensing structures, and existing solutions like additional interconnecting structures lead to noise and thickness issues.

Innovation Solution

An antenna device with a dielectric layer and bending connection portions between upper and lower electrode layers, which allows for efficient signal transmission and reception without additional conductive members, preventing thickness increase and noise generation, and is suitable for high-frequency communication bands like 3G, 4G, and 5G.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional antenna structures are used in thin display devices, then antenna function is provided, but thickness increases and mutual interference with pixel structures occurs

Engineering Contradiction:
Improveantenna radiation reliabilityVSAvoidantenna thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent transitions from a conventional three-dimensional antenna structure to a two-dimensional planar antenna structure that is integrated within the display device's surface. The antenna is formed as a patterned electrode layer on the display substrate, utilizing the surface area rather than occupying additional thickness, thereby resolving the contradiction between providing antenna function and maintaining thin profile.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The antenna structure is merged with the display device's existing electrode layers and signal transmission lines. The radiation pattern electrode is integrated with the pixel electrode structure, and the ground electrode is combined with the common electrode layer, eliminating the need for separate antenna components and reducing overall thickness while maintaining radiation reliability.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If additional interconnecting structures are employed to connect electrodes and pads, then electrode connection is achieved, but thickness increases and mutual interferences and noises are caused

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidnoise and interference
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The antenna's radiation pattern electrode is directly integrated with the pixel electrode, and the ground electrode is combined with the common electrode layer. This merging eliminates the need for additional interconnecting structures such as vias and conductive bridges, thereby reducing thickness and minimizing noise and interference that would be generated by extra conductive paths.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the additional interconnecting structures (vias, conductive bridges, and extra connection layers) from the antenna design. By directly utilizing the existing electrode layers for antenna functions, the harmful interconnections are removed, reducing noise and interference while maintaining signal transmission reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS11600911B2Antenna device and display device including the same
Publication Date: 2023.03.07 DONGWOO FINE CHEM CO LTD
  • US11600911B2 patent drawing
  • US11600911B2 patent drawing
  • US11600911B2 patent drawing

AI summary

An antenna device according to an embodiment of the present invention includes a dielectric layer, an upper electrode layer disposed on the dielectric layer and including a radiation pattern, a lower electrode layer disposed on the dielectric layer, and a bending connection portion integrally connected to the upper electrode layer and the lower electrode layer on the dielectric layer. An interconnection of a ground layer is implemented with high reliability by the bending connection portion.