Antenna Circuit Board Slit Shielding for Bezel Interference
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Solution Overview
Problem
High-frequency and ultra-high-frequency antennas in image display devices face challenges with signal interference and radiation disturbances due to electrical interference in the bezel area, leading to reduced antenna gain and reliability.
Innovation Solution
A circuit board for antennas featuring a conductive layer with slit portions and a feeding ground portion is designed to improve radiation properties and electrical reliability by enhancing signal concentration and reducing noise interference, with specific ratios of width for the feeding ground and slit portions optimized for efficient signal transfer and noise attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the radiator is disposed within the display area and the transmission line length is reduced, then signal loss is reduced and antenna gain is improved, but the radiator becomes adjacent to the bezel area where electrical interference occurs, disturbing antenna radiation properties
Solution Approach 1:
The conductive layer is segmented into multiple regions: a first conductive region covering the signal wiring, a second conductive region adjacent to the first region, and a third conductive region adjacent to the second region. These segmented conductive regions create isolation zones that block electrical interference from the bezel area while maintaining signal integrity to the radiator.
Solution Approach 2:
The conductive layer acts as an intermediary shielding structure between the signal wiring and the interfering bezel area. By positioning the conductive layer with its multiple regions around the signal wiring, it mediates the electromagnetic environment, blocking harmful electrical interference while allowing the signal to reach the radiator effectively.
2Adaptability or versatility
If the antenna operates in high frequency or ultra-high frequency band (20 GHz or more), then communication capability is enhanced, but signal and frequency disturbance occurs even by small electrical interference and external noise
Solution Approach 1:
The conductive layer is divided into multiple segmented regions (first, second, and third conductive regions) that create multiple isolation zones around the signal wiring. This segmentation provides enhanced shielding effectiveness at high frequencies by blocking external noise and electrical interference from the bezel area, thereby maintaining signal stability and reliability in the 20 GHz or more frequency range.
3Object-affected harmful factors
If a solid conductive layer is used to shield the signal wiring, then electrical interference is blocked, but coupling and electric field interference are generated between metal layers in the bonding region
Solution Approach 1:
The conductive layer is segmented into multiple separate regions (first, second, and third conductive regions) rather than using a continuous solid layer. This segmentation reduces the total conductive area in the bonding region, thereby minimizing coupling and electric field interference between metal layers while still providing effective shielding against electrical interference through the distributed conductive regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases antenna gain and reliability by improving signal concentration and reducing noise interference, maintaining stable gain values across a wide frequency range, particularly in high-frequency and ultra-high-frequency bands.
Implementation Method 1
A circuit board for an antenna including a feeding circuit wiring, an antenna package including the same and an image display device including the same... improved radiation property and electrical reliability... signal concentration and reducing noise interference
Data Source
AI summary
A circuit board for an antenna includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer, and a conductive layer disposed on the second surface of the core layer to cover the signal wiring in a plan view. The conductive layer has a slit portion formed around the signal wiring in the plan view.