Antenna Circuit Board Stack Non-Feed Via Isolation
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Solution Overview
Problem
Existing antenna systems face challenges in forming conductive vias that connect signal lines or ground planes without intersecting radiating elements, which increases manufacturing complexity and cost, especially at higher frequencies.
Innovation Solution
The formation of non-feed vias that extend through the entire circuit board stack, including areas overlaid by radiating elements, without direct electrical connection, using a single drilling step and relieved areas in the radiating elements to prevent contact, allowing for simplified and cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vias are formed in areas overlaid by radiating elements, then manufacturing complexity and cost increase, but via connectivity and integration improve
Solution Approach 1:
Relieved areas are formed in the radiating elements before via formation, pre-positioning non-conductive regions that will accommodate vias. This preliminary action allows subsequent via drilling to proceed without intersecting conductive materials, eliminating the need for complex back-drilling or multiple drilling cycles while maintaining via connectivity through radiating elements.
Solution Approach 2:
The radiating element is segmented by creating relieved areas that remove conductive material from specific regions. This segmentation allows vias to be formed in these relieved areas without electrical connection to the radiating element, enabling simplified single-pass via formation while maintaining the integrity and continuity of the radiating element in its functional regions.
2Reliability
If vias extend through less than entire circuit board stack, then radiating element isolation is maintained, but manufacturing complexity and cost increase
Solution Approach 1:
Relieved areas are created in advance in the radiating elements at locations where vias will be formed. This preliminary removal of conductive material ensures that when vias are drilled through the entire circuit board stack, they pass through non-conductive regions and do not create unwanted electrical connections to the radiating element, thereby maintaining signal isolation throughout the full via length.
3Ease of manufacture
If non-feed vias are formed through entire circuit board stack, then manufacturing cost and complexity reduce, but potential interference with radiating elements increases
Solution Approach 1:
Relieved areas are formed in the radiating elements before via creation, pre-establishing non-conductive zones that will accommodate non-feed vias. This preliminary action ensures that when non-feed vias are drilled through the entire circuit board stack, they pass through these relieved areas without making electrical contact with the radiating element, thereby eliminating RF interference while enabling cost-effective single-pass via formation.
Solution Approach 2:
Conductive material is extracted from specific regions of the radiating element to create relieved areas. This extraction removes the harmful interaction between vias and radiating elements, allowing non-feed vias to be formed through the entire circuit board stack without causing RF interference, while maintaining the radiating element's functionality in remaining regions.
Data Source
AI summary
An antenna system circuit board stack with feed vias and with non-feed vias is disclosed. An antenna system circuit board stack as disclosed herein can include a plurality of patches or radiating elements formed on a common plane comprising a first surface of a circuit board. Each radiating element is electrically connected to one or more feed vias. In addition non-feed vias extend through, but are electrically isolated from, the radiating elements. An antenna system as disclosed herein enables the costs associated with multiple beam antenna systems, including but not limited to 5G communication systems, to be reduced as compared to alternative techniques.