Antenna Bracket Structure for Heat Dissipation and Radiation Stability
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Solution Overview
Problem
Existing antenna support structures in electronic devices do not adequately address heat dissipation and radiation performance degradation, particularly in high-frequency bands used by next-generation wireless communication technologies.
Innovation Solution
An antenna support structure is designed with a bracket system featuring protrusions and recesses that overlap with chip antennas, utilizing dielectric materials to enhance heat dissipation and minimize radiation performance degradation, while supporting the antenna structure within the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple bracket support structure is used for the antenna, then the device complexity is reduced and manufacturing is easier, but heat dissipation performance deteriorates and radiation performance degrades
Solution Approach 1:
The bracket structure implements local quality by creating specific protrusions and recesses at strategic locations. The protrusions contact the substrate at discrete points while recesses provide heat dissipation pathways, optimizing thermal management without requiring complete structural redesign. This localized optimization resolves the contradiction by adding complexity only where thermally critical.
Solution Approach 2:
The bracket is segmented into multiple functional regions including protrusions for mechanical support, recesses for heat dissipation, and overlapping regions for radiation performance optimization. This segmentation allows each region to be independently optimized for its specific function while maintaining overall structural integrity.
2Device complexity
If a simple bracket support structure is used for the antenna, then the device complexity is reduced, but radiation performance deteriorates
Solution Approach 1:
The bracket design applies local quality by creating specific geometric features (protrusions and recesses) that interact with antenna elements at critical locations. These localized features are positioned to overlap with chip antennas in controlled manner, maintaining radiation patterns while simplifying overall bracket design.
Solution Approach 2:
The bracket serves as an intermediary structure between the antenna substrate and device housing. By incorporating protrusions and recesses, it mediates between mechanical support requirements and electromagnetic performance, allowing the simplified structure to maintain radiation performance through strategic geometric features.
3Temperature
If the bracket overlaps with chip antennas, then heat dissipation is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The bracket design incorporates protrusions and recesses that are pre-configured to align with chip antenna locations. This preliminary action establishes alignment references during bracket fabrication, reducing the precision requirements during final assembly. The overlapping regions are designed with tolerances that accommodate manufacturing variations.
Solution Approach 2:
The bracket geometry parameters (protrusion height, recess depth, overlap dimensions) are optimized to provide adequate heat dissipation while maintaining manufacturing feasibility. By adjusting these parameters within acceptable ranges, the design achieves thermal performance without requiring extreme manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively reduces heat dissipation challenges and maintains radiation performance by optimizing the bracket's design to overlap with antenna elements, thereby improving overall antenna efficiency in high-frequency communication.
Implementation Method 1
utilizing dielectric materials to enhance heat dissipation and minimize radiation performance degradation
Implementation Method 2
enhance heat dissipation
Implementation Method 3
enhance heat dissipation
Data Source
AI summary
An electronic device includes a housing, an antenna structure disposed in an inner space of the housing, a wireless communication circuit disposed in the inner space, and a first bracket. The antenna structure includes a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction. Each of the plurality of chip antennas includes an antenna element and is separated in the third direction from remaining chip antennas by separation spaces. The first bracket includes first and second protrusions that protrude in the second direction to correspond to the first substrate surface of the substrate. The protrusions are aligned, in the third direction, with the separation spaces.