Built-in Antenna Module Using Case Frame Grounding
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Solution Overview
Problem
Existing built-in antenna modules for portable wireless terminals face challenges in improving radiation characteristics and reducing Specific Absorption Rate (SAR) while maintaining a slim profile, as they require complex assembly processes and high manufacturing costs due to the need for separate ground plates to increase the distance between the antenna radiator and the ground surface.
Innovation Solution
A built-in antenna module that utilizes the case frame of the terminal to maximize the distance between the antenna radiator and the ground surface by grounding the antenna radiator with the inner surface of the case frame and the main board's ground layer, eliminating the need for a separate ground plate and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate ground plate is installed on the main board to increase the distance between the antenna radiator and the ground surface, then the radiation characteristic is improved, but the assembly process becomes complicated and manufacturing cost increases
Solution Approach 1:
The case frame is merged with the ground function by installing a conductor on its inner surface and electrically connecting it to the ground layer. This combines the structural support function of the case frame with the grounding function, eliminating the need for a separate ground plate and simplifying the assembly process while maintaining the required distance between the antenna radiator and ground surface
Solution Approach 2:
The case frame is given multiple functions: it serves as both the structural exterior of the terminal and as the ground surface for the antenna radiator. By making the case frame serve dual purposes, the design eliminates unnecessary components and simplifies assembly while improving radiation characteristics
2Reliability
If a separate ground plate is installed to increase the distance between the antenna radiator and the ground surface, then the radiation characteristic is improved, but the manufacturing cost increases
Solution Approach 1:
The case frame is merged with the ground function by installing a conductor on its inner surface and electrically connecting it to the ground layer. This combines the structural support function of the case frame with the grounding function, eliminating the need for a separate ground plate and simplifying the assembly process while maintaining the required distance between the antenna radiator and ground surface
Solution Approach 2:
The case frame is given multiple functions: it serves as both the structural exterior of the terminal and as the ground surface for the antenna radiator. By making the case frame serve dual purposes, the design eliminates unnecessary components and simplifies assembly while improving radiation characteristics
3Reliability
If the distance between the antenna radiator and the ground surface is increased to improve radiation characteristic, then the radiation characteristic is improved, but the terminal volume increases
Solution Approach 1:
The ground surface is relocated from the main board to the case frame, utilizing the terminal's thickness dimension. This allows the antenna radiator to be positioned closer to the main board while maintaining a large distance from the ground surface, achieving good radiation characteristics without increasing the terminal's footprint area
Data Source
AI summary
A built-in antenna module includes a main board including a feed pad, a ground pad, and a ground layer having a predetermined area; an antenna radiator installed on the main board to have a predetermined height, and including a feed pin and a ground pin, the feed pin and the ground pin being electrically connected to the feed pad and the ground pad of the main board, respectively; a conductor disposed on an inner surface of a case frame and having a predetermined area and thickness, the case frame providing an installation space for the main board and forming an exterior of the terminal; and at least one electrical connection unit interposed between the conductor and the main board and serving as a medium that electrically connects the conductor to the ground pad and the ground layer of the main board.