Antenna Chip Bonding on Transfer Substrate for RF Integration
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Solution Overview
Problem
Existing electronic devices with integrated RF signal transmit and/or receive antennas face manufacturing challenges that affect their performance and compactness, such as inefficient antenna element formation and connection methods.
Innovation Solution
A method involving the formation of antenna elements on a substrate, dicing to create chips, bonding these chips onto a transfer substrate with orthogonal surfaces, and forming conductive tracks and solder joints for electrical connection, allowing for compact design and improved radiation patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna elements are formed on a substrate and the substrate is diced to create chips, then the antenna can be integrated into the electronic device, but the manufacturing complexity and connection difficulty increase
Solution Approach 1:
The substrate is diced into multiple antenna chips, each containing an antenna element. This segmentation allows the antenna to be manufactured as a separate component that can be independently processed and then integrated into the electronic device, reducing overall manufacturing complexity
Solution Approach 2:
A transfer substrate is introduced as an intermediary component. The antenna chip is first formed on a first substrate, then transferred to the transfer substrate which provides standardized connection interfaces. This intermediary simplifies the connection process between the antenna chip and the electronic device
2Volume of moving object
If the antenna chip is bonded onto a transfer substrate with orthogonal surfaces, then the compactness of the device is improved, but the electrical connection difficulty increases
Solution Approach 1:
The antenna chip is bonded onto the transfer substrate with orthogonal surfaces, utilizing three-dimensional spatial arrangement. This vertical integration approach reduces the horizontal footprint of the device, improving compactness while maintaining electrical connection capabilities through conductive tracks formed on the transfer substrate
3Reliability
If conductive tracks and solder joints are formed to electrically connect antenna elements, then the electrical connection is improved, but the manufacturing steps increase
Solution Approach 1:
Conductive tracks are pre-formed on the transfer substrate before the antenna chip is mounted. This preliminary action ensures that the electrical connection pathways are already in place, allowing for reliable connections once the chip is bonded, while enabling parallel processing of multiple chips to maintain manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the compactness and performance of electronic devices by enabling efficient electrical connection and improved radiation patterns, suitable for various RF applications including Bluetooth, 3G, and 5G communications.
Implementation Method 1
Many electronic devices, particularly mobile telephony terminals, connected objects, etc., comprise one or a plurality of RF signal transmit and/or receive antennas integrated in a package of the device, to enable to the device to communicate at a distance and wireless, by radio waves, with one or a plurality of external devices
Implementation Method 2
The first antenna elements are formed by depositing an electrically-conductive material over the entire first surface of the first substrate
Implementation Method 3
a step of depositing a first solder joint between the first antenna element and the second conductive track
Implementation Method 4
a step of depositing a first solder joint between the first antenna element and the second conductive track
Data Source
AI summary
An electronic device integrates an antenna. To fabricate such an electronic device, first antenna elements are formed on a first surface of a first substrate. The first substrate is then diced to form antenna chips. Each antenna chip includes, on a first surface corresponding to the first surface of the first substrate, one of the first antenna elements. One of the antenna chips is then bonded onto a transfer substrate. This bonding is made between a second surface of the antenna chip, orthogonal to its first surface, and an upper surface of the transfer substrate.