Security Document Antenna Chip Contact Through-Openings
Solution Overview
Problem
Existing methods for producing semi-finished products with integrated antenna and circuit structures for security documents face challenges in preventing manipulation and ensuring a strong, tamper-proof connection, while also requiring cost-effective production and favorable integration properties.
Innovation Solution
A method involving the formation of through-openings in the overlapping areas of antenna and chip contact areas, allowing for a form-fitting connection during lamination, and using ultrasound to create a friction-welded connection between the antenna and chip structures, which enhances security and reduces delamination tendencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection methods (gluing, welding, soldering) are used to connect antenna and circuit structures, then electrical contact is established, but the connection can be separated or manipulated without discernible traces
Solution Approach 1:
The connection process is segmented into two distinct phases: first forming through-openings in the contact areas, then establishing electrical contact through these openings. This segmentation allows the mechanical interlocking feature (through-opening) to be created independently from the electrical connection, making the system more resistant to tampering while maintaining manufacturing feasibility through standardized process steps.
Solution Approach 2:
The through-openings are formed in advance before the electrical contact is established. This preliminary action creates a mechanical interlocking structure that prevents future separation or manipulation. By preparing the through-openings first, the patent ensures that subsequent electrical connection methods must pass through these pre-formed openings, thereby integrating security into the connection process itself.
2Reliability
If the semi-finished product is designed for complete integration into document body, then security against manipulation is improved, but the risk of delamination and separation increases
Solution Approach 1:
The patent merges the electrical contact function with a mechanical interlocking function by forming through-openings that extend through both the antenna contact area and the chip contact area. This combination creates a unified structure where the electrical connection and mechanical bonding occur through the same feature, simultaneously addressing security against manipulation and resistance to delamination.
Solution Approach 2:
The contact areas utilize composite construction with conductive adhesive material filling the through-openings. This composite approach combines the electrical conductivity of adhesive materials with the mechanical strength of the through-opening structure, creating a multi-functional connection that resists both manipulation and delamination while maintaining electrical contact.
3Reliability
If through-openings are formed in contact areas to prevent separation, then security is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex mechanical security features with a simpler through-opening formation process that can be integrated into existing manufacturing equipment. Instead of adding elaborate locking mechanisms or complex assembly steps, the solution uses straightforward through-opening creation followed by standard electrical contact methods, thereby enhancing security without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the security of the semi-finished products by making it difficult to separate or replace the circuit and antenna structures, while also reducing the likelihood of delamination and enhancing the product's suitability for everyday use by forming a strong, reliable electrical connection.
Implementation Method 1
the actuator is designed to couple ultrasound into the at least one antenna contact area and the at least one chip contact area, in such a way that a friction-welded connection is formed between the at least one antenna contact area and the at least one chip contact area
Implementation Method 2
a friction-welded connection is formed between the at least one antenna contact area and the at least one chip contact area
Data Source
Figure 1~2
Figure 3~5
Figure 6
AI summary
The invention relates to a method for producing a semi-finished good (21) or a security document (20) comprising the semi-finished good (21), to the semi-finished good (21), and to a device for the production thereof. A semi-finished good (21) comprises at least one substrate (1), a circuit structure (5) having at least one chip contact region (6), and an antenna structure (2) having at least one antenna contact region (4), wherein the antenna structure (2) and the circuit structure (5) are applied to the substrate (1) so that the at least one antenna contact region (4) and the at least one chip contact region (6) are adjacent to each other and overlap at least partially in an overlapping region (8), and an electrical contact is formed between the at least one antenna contact region (4) and the at least one chip contact region (6) in the overlap region, wherein at least one pass-through opening (7) is formed in the overlap region (8), permeating the at least one antenna contact region (4) and the at least one chip contact region (6).