Antenna Device with Integrated Chip Substrate and Bonding Segments
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Solution Overview
Problem
RFID devices face issues such as chip cracking and antenna disconnection due to the gap between the integrated circuit chip and the antenna substrate, and the use of flexible or plastic IC chips requires greater pressure and longer bonding times, leading to manufacturing challenges.
Innovation Solution
An antenna device design where the chip is positioned between the substrate and the antenna, with bonding line segments covering the chip's pads to ensure secure electrical connection, and a manufacturing method involving a substrate preparation, chip placement, and antenna formation steps to minimize thickness and prevent disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If an antenna substrate is used to carry an antenna with a gap between the IC chip and the antenna substrate, then the antenna can be properly positioned, but the overall thickness increases and the device becomes prone to chip cracking and antenna disconnection
Solution Approach 1:
The patent merges the antenna and IC chip onto the same substrate (flexible printed circuit board), eliminating the gap between them. The antenna is formed directly on the substrate using conductive patterns, while the IC chip is mounted on the same substrate, creating an integrated structure that reduces overall thickness and prevents disconnection issues.
Solution Approach 2:
The patent transitions from a three-dimensional stacked structure (antenna substrate separate from chip substrate) to a two-dimensional planar integration where both antenna and chip coexist on the same flexible substrate plane, thereby reducing the thickness dimension while maintaining functional separation.
2Strength
If greater pressure and longer bonding time are used to bond flexible or plastic IC chips to the antenna substrate, then bonding strength is improved, but the chip is readily cracked and the manufacturing process takes longer
Solution Approach 1:
The patent changes the bonding parameters by using reflow soldering technology with specific temperature profiles (heating to melting point of solder material and maintaining for set time) instead of conventional high-pressure bonding. This temperature-based bonding approach achieves strong adhesion without applying excessive mechanical pressure that could crack flexible or plastic chips.
3Strength
If greater pressure and longer bonding time are used to bond flexible or plastic IC chips, then bonding strength is improved, but the manufacturing process takes longer
Solution Approach 1:
The patent replaces the mechanical bonding system (pressure-based thermocompression bonding) with a thermal bonding system (reflow soldering). This substitution eliminates the need for prolonged high-pressure application while achieving equivalent or superior bonding strength through controlled heating and solder melting, thereby reducing manufacturing cycle time.
Data Source
AI summary
An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.