Antenna Cladding Layout to Prevent Singulation Cracking
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Solution Overview
Problem
High dielectric constant dielectric materials used in electronic devices, such as antennas, are prone to cracking and chipping during the singulation process, leading to reduced cutting tool life and potential performance issues due to over-plating of the shielding layer, which can affect the device's appearance and functionality.
Innovation Solution
The electronic device design includes a carrier with a cladding element that covers the antenna element, enhancing antenna gain while exposing a second area distant from the antenna, reducing the amount of material to be cut during singulation and minimizing cracking, and strategically positioning the encapsulant to avoid over-plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high Dk dielectric material is used to cover the antenna, then antenna performance is enhanced, but cutting tool life is reduced and cracking/chipping occurs during singulation
Solution Approach 1:
The patent introduces a recess in the encapsulant that segments the high Dk dielectric material into two parts: a first part covered by the encapsulant and a second part exposed at the edge. This segmentation reduces the amount of hard material the cutting tool must traverse during singulation, thereby extending cutting tool life while maintaining antenna performance through the covered first part.
Solution Approach 2:
The patent extracts or removes a portion of the high Dk dielectric material at the edge to create a recess. This extracted region eliminates the problematic hard material from the cutting path during singulation, preventing cracking and chipping while preserving the dielectric material's antenna-enhancing properties in the retained first part.
2Reliability
If high Dk dielectric material is used to cover the antenna, then antenna performance is enhanced, but cracking and chipping occur on the edge
Solution Approach 1:
The recess segments the dielectric material so that only the necessary first part remains covered for antenna performance, while the second part is removed to create an edge geometry that prevents cracking and chipping during subsequent manufacturing steps.
Solution Approach 2:
By taking out or removing the second part of the dielectric material at the edge, the patent eliminates the source of cracking and chipping while maintaining sufficient dielectric coverage for antenna functionality.
3Strength
If the encapsulant covers the entire carrier surface, then complete protection is provided, but over-plating of the shielding layer occurs covering the antenna
Solution Approach 1:
The patent applies local quality by providing encapsulant coverage only where needed (the first part of the dielectric material adjacent to the antenna) rather than uniform coverage across the entire carrier. This localized protection maintains antenna performance by preventing over-plating in critical areas while still providing adequate protection where required.
Solution Approach 2:
The encapsulant coverage is segmented to match the recess geometry, covering only the first part of the dielectric material and leaving the second part exposed. This segmentation prevents the encapsulant from interfering with the shielding layer plating process over the antenna region.
Data Source
AI summary
An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.