Antenna Coil Nested in Conductive Plate for Thin Devices

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Solution Overview

Problem

In electronic devices with limited space, such as thin designs, it is challenging to ensure optimal antenna performance due to insufficient mounting space, which affects the manufacturing process and efficiency.

Innovation Solution

The electronic device incorporates a conductive coil with multiple turns connected to a communication circuit, a conductive plate, and non-conductive materials to form the housing, allowing for efficient space utilization and simplified manufacturing by removing bridges to separate the coil from the plate, thereby improving antenna performance and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If an antenna is installed in electronic devices with thin design, then the device thickness is reduced, but antenna performance deteriorates due to insufficient mounting space

Engineering Contradiction:
Improvedevice thicknessVSAvoidantenna performance
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The conductive coil is formed inside the conductive plate in a nested configuration, allowing the antenna structure to be embedded within the housing thickness rather than requiring additional external space. The coil is positioned within the plate's thickness dimension, enabling compact integration while maintaining antenna functionality in thin devices

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The antenna structure transitions from a planar two-dimensional layout to a three-dimensional configuration by forming the conductive coil within the thickness dimension of the conductive plate. This vertical integration utilizes the Z-axis space within the housing, allowing antenna elements to be stacked or nested within the plate thickness rather than requiring lateral expansion

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If traditional antenna manufacturing processes are used, then antenna performance can be maintained, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveantenna performanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The antenna manufacturing process is merged with the housing manufacturing process by forming the conductive coil and conductive plate as integrated components during housing production. The coil is formed within the plate using the same molding or manufacturing operations, eliminating the need for separate antenna assembly steps and reducing overall manufacturing complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing structure serves multiple functions: it provides mechanical support, forms the exterior shell, and integrates the antenna system through the conductive plate and coil. The conductive plate simultaneously acts as a structural component and an antenna element, while the housing material serves both structural and electromagnetic shielding functions

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10305313B2Antenna, manufacturing process thereof and electronic device using the antenna
Publication Date: 2019.05.28 SAMSUNG ELECTRONICS CO LTD
  • US10305313B2 patent drawing
  • US10305313B2 patent drawing
  • US10305313B2 patent drawing

AI summary

According to an exemplary embodiment of the present disclosure, an electronic device may include a housing having a first side facing a first direction, and a second side facing a second direction opposite to the first direction, a communication circuit disposed inside the housing, a display exposed through the first side of the housing, a conductive plate formed adjacent to the second side of the housing, a conductive coil formed inside the conductive plate when viewed from a top of the second side, and having a plurality of turns electrically connected to the communication circuit, a first non-conductive material formed inside the conductive plate when viewed from the top of the second side, and disposed at least partially between the conductive plate and the conductive coil and/or between the plurality of turns of the conductive coil, and a second non-conductive material for forming at least one part of the second side, and covering the conductive plate, the conductive coil, and the first non-conductive material. Various other exemplary embodiments are also possible.