Antenna Conductive Pattern for Millimeter Wave Isolation
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Solution Overview
Problem
Next-generation wireless communication technologies face challenges in maintaining antenna radiation performance due to the increasing use of millimeter waves and the physical constraints of electronic devices becoming thinner, leading to potential overlap and degradation of antenna performance.
Innovation Solution
A conductive pattern is integrated into the antenna structure for frequencies ranging from 0.5GHz to 6GHz, preventing radiation performance degradation caused by close or overlapping placement, ensuring operational reliability of electronic devices by supporting frequencies up to 100GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a communication device including an array structure is mounted inside an electronic device to overcome high free space loss and increase antenna gain, then antenna gain is improved, but previously placed antennas may decrease in radiation performance due to close or overlapping placement
Solution Approach 1:
The patent introduces a ground structure extending in the vertical direction (z-axis) beneath the antenna array, creating a three-dimensional spatial separation. This vertical dimension allows the antenna array and ground structure to coexist without overlapping, maintaining radiation performance while enabling millimeter wave communication functionality.
Solution Approach 2:
The ground structure acts as an intermediary element between the antenna array and the electronic device housing. It provides electromagnetic isolation and impedance control, preventing harmful interactions between the antenna array and other components, thus maintaining radiation performance in a compact form factor.
2Length of moving object
If the electronic device is made thinner to reduce size, then device thickness is reduced, but antennas may overlap or be placed close together causing performance degradation
Solution Approach 1:
The ground structure extends vertically beneath the antenna array, utilizing the z-axis dimension to achieve spatial separation. This allows thin-profile device design while maintaining adequate isolation between antenna elements and other components, preventing performance degradation despite reduced device thickness.
Solution Approach 2:
The ground structure is nested beneath the antenna array in the vertical direction, creating a compact layered configuration. This nested arrangement enables both structures to coexist in a thin profile without overlapping in the horizontal plane, maintaining radiation performance while achieving device thinness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains antenna performance across a wide frequency range, ensuring reliable communication in electronic devices despite physical constraints, thereby addressing the limitations of existing technologies.
Implementation Method 1
A conductive pattern is integrated into the antenna structure for frequencies ranging from 0.5GHz to 6GHz, preventing radiation performance degradation
Implementation Method 2
supporting frequencies up to 100GHz
Data Source
Figure 1
Figure 2A~2B
Figure 2C
AI summary
An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a first PCB disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate, at least one conductive plate formed on the second face, a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate, a first wireless communication circuit mounted on a first face of the first PCB, electrically coupled to the conductive plate and the first conductive pattern.