Antenna Conductor for Thermal Management in Miniaturized Devices
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Solution Overview
Problem
As electronic devices become high-performance and miniaturized, they face thermal issues due to the reduction of empty space, leading to heat management challenges, particularly in regions with high temperatures.
Innovation Solution
Incorporating a conductor that transmits heat from hotter regions to cooler regions within the device, where the conductor also functions as part of the antenna, adjacent to it, to manage thermal dissipation without degrading radio frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the empty space in electronic devices is reduced to achieve miniaturization, then the device size is reduced, but thermal management problems worsen due to heat accumulation
Solution Approach 1:
The patent combines the antenna structure with the heat dissipation conductor into a single integrated component. The conductor serves dual functions: transmitting RF signals as an antenna and conducting heat from high-temperature regions to low-temperature regions, thereby resolving the contradiction between miniaturization and thermal management by eliminating the need for separate heat dissipation structures
Solution Approach 2:
The conductor is designed to perform multiple functions simultaneously: it acts as both an antenna for wireless communication and a heat dissipation pathway. This multi-functionality allows the device to maintain effective communication capabilities while effectively managing thermal issues in the miniaturized structure
2Temperature
If a separate heat dissipation structure is added to manage thermal issues, then thermal management improves, but device complexity and space consumption increase
Solution Approach 1:
The patent merges the heat dissipation function with the existing antenna structure by using the conductor for both purposes. This integration avoids adding separate heat dissipation components, thereby improving thermal management without increasing device complexity or consuming additional space
3Loss of energy
If the conductor is placed adjacent to the antenna, then heat transmission efficiency improves, but RF performance may be degraded due to interference
Solution Approach 1:
The patent merges the conductor with the antenna structure itself, making them adjacent by design rather than by proximity. The conductor operates as part of the antenna system, ensuring that heat transmission occurs along the same structure that transmits RF signals, thereby maintaining RF performance while achieving effective heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively addresses thermal challenges by transferring heat from high-temperature areas to lower-temperature areas, enhancing the device's operational efficiency while maintaining effective communication capabilities.
Implementation Method 1
a conductor configured to transmit heat of the first region to the second region
Data Source
AI summary
An electronic device includes a first region corresponding to a first part of the electronic device, and a second region corresponding to a second part of the electronic device. The second region has a lower temperature than that of the first region. An antenna is located over at least the first region and optionally the second region of the electronic device. A conductor is arranged over at least the first region of the electronic device to transmit heat from the first region to the second region. The conductor operates in conjunction with the antenna and is adjacent to at least a part of the antenna to prevent the conductor from interfering with the antenna.