Vehicular Antenna Connector Capacitive Coupling via Insulating Adhesive

The patent replaces the traditional soldering process (thermal-mechanical connection method) with a conductive adhesive bonding process (chemical-mechanical connection method). The connector is mounted using a conductive adhesive that bonds at lower temperatures, avoiding glass damage while providing both mechanical strength and electrical connection through the adhesive material itself.

The patent changes the bonding temperature parameter from high temperature (soldering at melting point of unleaded solder) to low temperature (conductive adhesive curing temperature). This parameter change allows the glass substrate to remain undamaged while achieving reliable mechanical and electrical connection through the conductive adhesive material.

The patent employs a composite conductive adhesive material that combines adhesive polymer matrix with conductive filler particles (such as metal powders or carbon materials). This composite structure allows the material to simultaneously exhibit both adhesive properties (for mechanical bonding) and conductive properties (for electrical connection), resolving the trade-off between electrical conductivity and adhesive strength.

The conductive adhesive exhibits different local properties: the polymer matrix provides adhesive strength and binding, while the dispersed conductive filler particles provide electrical conductivity. This local differentiation of functions within the same material allows simultaneous achievement of both adhesive and conductive requirements.