Antenna Cover Thickness Compensation for Multi-Band 5G Beams

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Solution Overview

Problem

Current cover devices for ultrahigh frequency bands in 5G communication systems are sensitive to dielectric constants and losses, requiring optimized thicknesses for each frequency band, leading to the need for separate molds for each frequency band, which is inefficient.

Innovation Solution

A cover device with a thickness compensation structure that can be adjusted within a common mold to achieve optimal thicknesses for various frequency bands, eliminating the need for separate molds by positioning different thicknesses in specific areas of the cover frame corresponding to the frequency bands of the antenna beam.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If separate molds are produced for each frequency band to achieve optimal thickness, then manufacturing precision for each frequency band is improved, but device complexity and production cost increase

Engineering Contradiction:
Improvecover thickness optimizationVSAvoidnumber of molds
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A single common mold is designed to produce cover frames that can accommodate multiple frequency bands. The mold includes a configurable thickness compensation structure that can be adjusted to provide different thickness values corresponding to different frequency bands, allowing one mold to serve multiple functions that previously required separate molds for each band.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The thickness compensation structure is positioned in specific local areas of the cover frame where thickness adjustment is needed. This structure includes multiple thickness compensation portions that can be selectively configured to provide different thickness values in different regions, enabling precise local thickness optimization for different frequency bands without affecting the entire cover frame structure.

Inventive Principle:
Principle #3Local quality

2Device complexity

If a common mold is used for all frequency bands, then device complexity is reduced, but manufacturing precision for optimal thickness varies across frequency bands

Engineering Contradiction:
Improvenumber of moldsVSAvoidcover thickness optimization
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The thickness compensation structure is designed to be dynamically configurable within the common mold. Different thickness compensation portions can be selectively activated or adjusted based on the target frequency band, allowing the mold to adapt its output dimensions dynamically. This dynamic configuration capability enables a single mold to achieve the precision of multiple specialized molds by changing its effective thickness profile.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention changes the thickness parameter of the cover frame by incorporating a thickness compensation structure with multiple thickness compensation portions. Each portion corresponds to a specific frequency band and provides a predetermined thickness value. By selecting and configuring the appropriate thickness compensation portions, the mold can produce cover frames with optimized thickness values for different frequency bands using the same basic mold structure.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If separate molds are produced for each frequency band, then manufacturing precision is improved, but productivity decreases due to multiple mold production requirements

Engineering Contradiction:
Improvecover thickness optimizationVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The common mold with configurable thickness compensation structure serves as a universal manufacturing tool that can produce cover frames for multiple frequency bands. This eliminates the need to produce and maintain separate molds for each frequency band, significantly improving production efficiency. The mold can be reconfigured between production runs to accommodate different frequency band requirements, maintaining precision while reducing the overall number of molds needed in the manufacturing system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12183969B2Cover apparatus for optimal beam implementation for antenna in wireless communication system
Publication Date: 2024.12.31 SAMSUNG ELECTRONICS CO LTD
  • US12183969B2 patent drawing
  • US12183969B2 patent drawing
  • US12183969B2 patent drawing

AI summary

The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.