Crimped Antenna Cable Joint Without Soldered Conductive Film

The patent replaces the thermal/mechanical soldering process with a mechanical crimping system. The crimp portion of the antenna body is formed to mechanically clamp the conductive film between itself and the cable connector, eliminating the need for soldering while maintaining secure electrical connection. This mechanical substitution simplifies the assembly process and reduces manufacturing complexity.

The patent changes the connection method from thermal bonding (soldering) to mechanical bonding (crimping). The crimp portion is designed with specific geometric parameters that allow it to deform and clamp the conductive film securely. This parameter change in the connection mechanism eliminates soldering requirements while maintaining reliable electrical connection between the conductive film and cable.

The patent replaces the time-consuming soldering process with a rapid mechanical crimping operation. The crimp portion is pre-formed on the antenna body to match the cable connector geometry, allowing for quick assembly without heating equipment, flux application, or cooling time. This mechanical system dramatically improves production efficiency while maintaining secure electrical connection through the crimped joint.

The crimp portion is pre-formed on the antenna body during the molding process, before assembly with the cable and conductive film. This preliminary action eliminates the need for post-assembly soldering operations, allowing the conductive film to be simply夹持 between the crimp portion and cable connector. This pre-prepared structure significantly accelerates production while ensuring reliable electrical connection.

The patent replaces the multi-step soldering process with a single mechanical crimping action. The crimp portion is designed with sufficient clamping force to create a strong mechanical and electrical joint between the antenna body, conductive film, and cable connector. This mechanical joint achieves adequate strength without the time-consuming soldering steps, reducing overall process time while maintaining joint integrity.

The patent changes the joint formation method from thermal fusion (soldering) to mechanical deformation (crimping). The crimp portion geometry and material properties are optimized to provide sufficient clamping force and electrical conductivity. This parameter change in the connection mechanism achieves adequate joint strength for the application while eliminating the time loss associated with soldering processes.