Packaged Antenna Substrate Dielectric Stack for Patch Spacing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing antenna packaged substrates face challenges in reducing the distance between antenna radiating patches while maintaining performance requirements for specific frequency bands, leading to complex processing, increased costs, and deteriorated performance due to high dielectric constants and large interlayer dielectric layers.
Innovation Solution
The use of a dielectric stack with a first dielectric layer having a low dielectric constant, such as polytetrafluoroethylene, and a second dielectric layer with a lower expansion coefficient, along with a bonding layer, to reduce the equivalent dielectric constant and thickness between antenna radiating patches, thereby simplifying processing and improving antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large distance is maintained between the two antenna radiating patches by disposing a plurality of interlayer dielectric layers, then a performance requirement of a specific frequency band is met, but the processing process becomes more difficult, the quantity of interlayer dielectric layers increases, leading to a long processing process, a long cycle, and high costs
Solution Approach 1:
The patent employs a composite dielectric stack structure consisting of a first dielectric layer with low dielectric constant (such as PTFE with εr≈2.17) and a second dielectric layer with low expansion coefficient. This composite structure allows the antenna packaged substrate to achieve the required frequency band performance with reduced total thickness, thereby reducing the quantity of interlayer dielectric layers from multiple layers to just two layers, simplifying the processing process and reducing costs while maintaining reliable antenna performance
2Device complexity
If the distance between the two antenna radiating patches is reduced, then the processing process is simplified and costs are reduced, but the performance requirement of a specific frequency band may not be met
Solution Approach 1:
The patent changes the dielectric constant parameter of the dielectric layers by selecting a first dielectric layer with low dielectric constant (εr≈2.17 for PTFE) compared to conventional high dielectric constant materials. This parameter change allows the electromagnetic wave propagation characteristics to be maintained or improved with a shorter distance between antenna radiating patches, enabling the processing process to be simplified while meeting the performance requirements of specific frequency bands
3Reliability
If a dielectric layer with high expansion coefficient is used, then the dielectric constant is reduced improving antenna gain and bandwidth, but substrate warpage occurs
Solution Approach 1:
The patent uses a composite dielectric stack where the first dielectric layer (with low dielectric constant) is combined with a second dielectric layer (with low expansion coefficient). The second dielectric layer acts as a counterbalance to the thermal expansion of the first dielectric layer, preventing substrate warpage while allowing the first dielectric layer to provide the desired low dielectric constant for improved antenna gain and bandwidth
Solution Approach 2:
The patent addresses thermal expansion issues by selecting a second dielectric layer with expansion coefficient lower than that of the first dielectric layer. This creates a compensatory effect where the second layer counteracts the thermal expansion of the first layer, preventing substrate warpage while maintaining the low dielectric constant benefit of the first layer for improved antenna performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the processing complexity and costs by minimizing the number of dielectric layers, enhancing gain and bandwidth, and mitigating substrate warpage, while maintaining the required performance for specific frequency bands.
Implementation Method 1
A dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, so that an equivalent dielectric constant of the dielectric stack between the first antenna radiating patch and the second antenna radiating patch can be reduced
Implementation Method 2
An expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer, to mitigate substrate warpage of the antenna packaged substrate caused by the relatively high expansion coefficient of the first dielectric layer
Data Source
AI summary
This application discloses an antenna packaged substrate, a manufacturing method of an antenna packaged substrate, a packaged antenna, and a terminal, and relates to the field of antenna packaging technologies, to simplify packaged antenna processing and improve antenna performance. The antenna packaged substrate includes: a substrate, a first antenna radiating patch disposed on a surface of the substrate, a second antenna radiating patch disposed over the first antenna radiating patch, and a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch. The dielectric stack includes a first dielectric layer, a bonding layer disposed on a side that is of the first dielectric layer and faces the first antenna radiating patch, and a second dielectric layer disposed on a side that is of the first dielectric layer and faces the second antenna radiating patch. A dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer. The antenna packaged substrate is used in a packaged antenna.