Individually Attached Antenna Elements for Millimeter Wave Package Warpage
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Solution Overview
Problem
Millimeter wave antennas in the 25-110 GHz band face challenges with package warpage due to material expansion differences, leading to delamination and reduced performance in phased array antenna implementations.
Innovation Solution
The solution involves individually attaching multiple antenna elements to the package with routing layers, creating air gaps between them, and using electromagnetic coupling or direct coupling, which reduces warpage and stress, allowing for improved mechanical and thermal reliability and increased antenna efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple antenna elements are grouped together in a phased array antenna, then transmission/reception distance and reception angle are improved, but package warpage occurs due to coefficient of expansion differences
Solution Approach 1:
The patent divides the antenna array into multiple independent antenna elements that are separately mounted on the package substrate. Each antenna element is individually attached rather than being integrated as a single structure, allowing independent thermal expansion and reducing stress concentration that causes package warpage.
Solution Approach 2:
The patent applies different material properties and structural configurations to different regions of the antenna array. Each antenna element can be optimized with specific materials and mounting configurations suitable for its location, allowing localized compensation for thermal expansion differences and reducing overall package warpage.
2Ease of manufacture
If antenna elements are integrated into a single structure, then manufacturing is simplified, but electromagnetic field confinement in substrate increases reducing antenna efficiency
Solution Approach 1:
The patent segments the antenna structure into multiple separate elements that are individually mounted on the package substrate. This segmentation prevents electromagnetic field confinement within a single integrated substrate structure, allowing each element to radiate more efficiently while still forming a functional phased array when grouped together.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces package warpage, improves antenna efficiency by reducing electromagnetic field confinement in the substrate, and enhances radiation performance with up to 18% improvement in radiated power and reduced side lobes.
Implementation Method 1
a plurality of separate antenna elements to form a phased array antenna, wherein each antenna element of the array is individually attached to a first side of the electronic package
Data Source
AI summary
Embodiments are generally directed to a package architecture for antenna arrays. An embodiment of an apparatus includes an electronic package, the electronic package including one or more routing layers; a transmitter to drive a signal for wireless transmission; and an assembled phased array antenna to transmit the signal, the assembled phased array antenna including a plurality of separate antenna elements in an array, each antenna element of the array being individually attached to a first side of the electronic package. The antenna elements include a first antenna element and a second antenna element, wherein the first antenna element is separated from the second antenna element by a gap.