Antenna Encapsulant Structure to Prevent Edge Cracking
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Solution Overview
Problem
High dielectric constant dielectric materials used in antenna devices are prone to cracking and chipping during the singulation process, affecting the appearance and performance of the antennas, potentially leading to failure in external appearance tests and performance degradation due to over-plating of shielding layers.
Innovation Solution
The antenna device features a first encapsulant with a main portion covering the antenna and an extending portion with a non-coplanar lateral surface, having a thickness less than the main portion, which reduces the risk of cracking and chipping, and a method for manufacturing this design involving a carrier with a second encapsulant and a shielding layer that minimizes over-plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high dielectric constant dielectric material is used to cover the antenna, then the antenna performance is enhanced, but cracking and chipping occur during the singulation process
Solution Approach 1:
The patent changes the physical parameters of the encapsulant by forming it with a thickness that is less than the thickness of the high Dk dielectric material, and creating a non-coplanar lateral surface. This parameter modification reduces the brittleness and stress concentration in the encapsulant, preventing cracking and chipping during singulation while maintaining the high Dk material's performance-enhancing properties.
Solution Approach 2:
The patent introduces a dimensional change by creating a non-coplanar lateral surface on the encapsulant, where the lateral surface of the encapsulant is non-coplanar with the lateral surface of the carrier. This three-dimensional structural modification allows the encapsulant to better accommodate stress during cutting operations, preventing edge damage while preserving the antenna's performance benefits.
2Reliability
If high dielectric constant dielectric material is used to cover the antenna, then the antenna performance is enhanced, but over-plating of shielding layer occurs
Solution Approach 1:
The patent modifies the thickness parameter of the encapsulant, making it thinner than the high Dk dielectric material. This creates a stepped structure that provides a physical barrier, preventing the shielding layer from over-plating onto the antenna while maintaining the performance benefits of the high Dk material.
Solution Approach 2:
The encapsulant is formed in advance before the shielding layer deposition process. This preliminary action creates a protective structure that prevents over-plating of the shielding layer onto the antenna during subsequent manufacturing steps, ensuring both antenna performance and manufacturing control.
3Manufacturing precision
If the encapsulant thickness is reduced at the edges, then cracking and chipping are minimized, but the structural strength may be compromised
Solution Approach 1:
The patent applies local quality by making the encapsulant thickness non-uniform, with the thickness being less at the edges compared to the center. This local thinning reduces stress concentration at the edges during singulation, preventing cracking and chipping, while the thicker center region maintains overall structural strength and support for the antenna.
Data Source
AI summary
An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.