Antenna Package Structure With Encapsulant Marking Window
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Solution Overview
Problem
The existing methods for laser marking on polyimide layers in semiconductor packaging result in blurred marks due to ablation or melting, leading to material wastage and alignment issues, which affect the reliability and yield of subsequent manufacturing operations.
Innovation Solution
A dielectric layer is patterned to form an opening before forming the encapsulant, allowing the laser marking to be performed on the encapsulant instead of the polyimide layer, ensuring a clear and residue-free laser mark.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If laser marking is performed on the polyimide layer, then the polyimide layer can be marked for identification, but the laser mark becomes blurred due to ablation or melting
Solution Approach 1:
The patent introduces an encapsulant as an intermediary layer between the polyimide layer and the laser marking target. The laser mark is formed on the encapsulant instead of directly on the polyimide layer, preventing ablation or melting of the polyimide while still achieving clear identification. The encapsulant serves as a mediator that absorbs the laser marking process without transferring harmful effects to the underlying polyimide layer.
2Loss of information
If laser marking is performed on the polyimide layer, then identification is achieved, but material wastage occurs due to ablation or melting
Solution Approach 1:
The encapsulant acts as a sacrificial intermediary that absorbs the laser energy and marking process, preventing direct interaction between the laser and the polyimide layer. This mediator approach allows the laser mark to be formed clearly on the encapsulant while the polyimide layer remains intact without ablation or melting, thereby eliminating material wastage.
3Loss of information
If laser marking is performed on the polyimide layer, then the polyimide layer can be identified, but alignment issues occur in subsequent operations
Solution Approach 1:
By forming the laser mark on the encapsulant rather than the polyimide layer, the patent creates a stable, residue-free marking surface that does not suffer from ablation or melting. This intermediary approach ensures that the laser mark remains sharp and clear, providing reliable alignment references for subsequent manufacturing operations without the distortion problems that would compromise manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the clarity and performance of the laser mark, reducing material wastage and ensuring accurate alignment and identification during subsequent operations, thereby enhancing the reliability and yield of the semiconductor packaging process.
Implementation Method 1
As the laser beam is projected on the polyimide layer, some portions of the polyimide layer would be ablated or melted.
Data Source
AI summary
Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.