Antenna Module Fan-Out Package Logic Layer Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional antenna modules for millimeter wave applications face inefficiencies in signal transfer due to signal attenuation, particularly when using coaxial cables, which are costly and inefficient in terms of space.
Innovation Solution
The design incorporates an antenna module with a fan-out package and redistribution layers that separate the logic layer from the antenna substrate, allowing for reduced thickness and improved manufacturing efficiency, while maintaining stable signal paths through a semiconductor chip and passive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the logic layer is integrated into the antenna substrate, then the antenna substrate thickness increases, but this causes increased manufacturing complexity and reduced manufacturing yield
Solution Approach 1:
The invention segments the antenna module into distinct components: the antenna substrate and the fan-out package. The logic layer is relocated from the antenna substrate to the fan-out package, separating the functions and allowing each component to be optimized and manufactured independently, thereby improving manufacturing yield while controlling substrate thickness.
Solution Approach 2:
The logic layer is moved from the two-dimensional plane of the antenna substrate to a separate three-dimensional fan-out package structure. This dimensional relocation allows the antenna substrate to remain thin while the logic functions are housed in the vertically stacked fan-out package, resolving the conflict between substrate thickness and manufacturing complexity.
2Loss of energy
If coaxial cable is used to connect RFIC and antenna, then signal attenuation is minimized, but this increases cost and space occupation
Solution Approach 1:
The invention merges the RFIC, passive elements, and antenna into a single integrated module. The fan-out package contains the semiconductor chip with RFIC and passive elements, which are electrically connected to the antenna patterns on the substrate. This integration eliminates the need for separate coaxial cables, reducing space occupation while maintaining signal integrity through direct electrical connections.
Solution Approach 2:
The fan-out package acts as an intermediary structure that provides direct electrical pathways between the RFIC and the antenna. Instead of using external coaxial cables, the signal transfers through integrated connection structures within the package, minimizing signal attenuation while eliminating the space requirements of external cabling.
3Productivity
If the logic layer is separated from the antenna substrate and placed in the fan-out package, then manufacturing yield improves, but this increases device complexity
Solution Approach 1:
The fan-out package serves multiple functions: it houses the semiconductor chip with RFIC and passive elements, provides electrical connections to the antenna, and contains the logic layer. This multi-functionality consolidates what would otherwise be separate components into a single integrated unit, improving manufacturing yield without proportionally increasing overall device complexity.
Data Source
AI summary
An antenna module includes an antenna substrate, a fan-out package and first electrical connection structures. The antenna substrate includes a pattern layer including antenna and ground patterns, and a feeding layer under the pattern layer including a feeding network that supplies power to the antenna patterns. The fan-out package is under the antenna substrate and includes a semiconductor chip driving the antenna substrate, an encapsulant encapsulating some of the semiconductor chip, a first redistribution layer on the semiconductor chip electrically connecting the semiconductor chip with the antenna substrate, and a second redistribution layer under the semiconductor chip electrically connecting the semiconductor chip with external devices. The first electrical connection structures are between and electrically connect the antenna substrate and the fan-out package. A logic layer including logic patterns electrically connecting the pattern layer with the feeding layer in the antenna substrate in the first redistribution layer in the fan-out package.