Antenna Feed Structure Through Die Via for Compact AiP RFICs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In high-frequency applications like millimeter wave RFICs, existing antenna-in-package (AiP) devices face challenges in reducing size due to difficulties in routing the antenna feeding structure to isolate and shield the feedline and antenna layer effectively.
Innovation Solution
The implementation of a semiconductor device with a via and a dielectric layer, where the antenna feeding structure comprises a portion within the semiconductor die and another portion through the dielectric layer, allowing for efficient coupling between the RF circuit and the antenna layer, enabling better isolation and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna feeding structure is routed through the semiconductor die and dielectric layer, then the isolation and shielding of the feedline and antenna layer is improved, but the device complexity increases
Solution Approach 1:
The antenna feeding structure is divided into multiple segments: a first portion within the semiconductor die and a second portion through the dielectric layer. This segmentation allows each portion to be optimized independently for its specific function, improving isolation and shielding while managing complexity through modular design.
Solution Approach 2:
The feeding structure transitions from a two-dimensional planar routing to a three-dimensional structure that extends through the die and dielectric layer. This dimensional change enables better spatial separation and shielding of the feedline from the antenna layer, improving isolation performance.
2Volume of moving object
If the antenna feeding structure uses a via-based configuration, then the package size is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The via structure is formed as part of the preliminary semiconductor die fabrication process, before final assembly. This preliminary action integrates the via formation into existing manufacturing workflows, reducing the need for additional high-precision steps and lowering overall manufacturing complexity.
Data Source
AI summary
A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.