Antenna Bandwidth Enhancement via Integrated Feed Line Resonator
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional patch antennas in wireless communication modules have limited bandwidth due to their structural simplicity, leading to increased manufacturing steps, costs, and thickness when additional dielectric layers and parasitic patches are added to enhance bandwidth.
Innovation Solution
An electronic package with an antenna structure that includes a carrier structure, an antenna body, a feed line, a conductive pillar, and an adjustment structure extending from the feed line, which acts as a stepped impedance resonator to enhance bandwidth without requiring additional manufacturing steps or thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dielectric layers and parasitic patches are added to enhance antenna bandwidth, then bandwidth is improved, but manufacturing steps, cost, and structure thickness increase
Solution Approach 1:
The adjustment structure is merged with the feed line by forming both on the same insulating layer using the same metal layer. This integration eliminates the need for separate adjustment structures and reduces manufacturing steps while achieving bandwidth enhancement through the stepped impedance resonator effect
Solution Approach 2:
The feed line is designed to serve dual functions: as the signal transmission path and as part of the adjustment structure (stepped impedance resonator) for bandwidth enhancement. This multi-functionality eliminates the need for dedicated adjustment structures, reducing device complexity
2Adaptability or versatility
If dielectric layers and parasitic patches are added to enhance antenna bandwidth, then bandwidth is improved, but structure thickness increases
Solution Approach 1:
Instead of adding adjustment structures in the vertical dimension (additional dielectric layers), the solution transitions to the planar dimension by designing the feed line with varying impedance segments on the same insulating layer. This achieves bandwidth enhancement without increasing structure thickness
3Adaptability or versatility
If adjustment structure is laminated on antenna body as build-up layer, then bandwidth is improved, but manufacturing cost and structure thickness increase
Solution Approach 1:
The adjustment structure and feed line are merged into a single integrated structure formed on the same insulating layer. This eliminates the need for separate lamination processes and additional materials, reducing manufacturing cost while maintaining bandwidth enhancement functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjustment structure improves antenna bandwidth and practicality by integrating with the feed line on the same insulating layer, reducing manufacturing complexity, cost, and overall structure thickness while maintaining yield.
Implementation Method 1
a conductive pillar electrically connecting the antenna body with the feed line
Implementation Method 2
an adjustment structure extending from the feed line, which acts as a stepped impedance resonator to enhance bandwidth
Data Source
AI summary
An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.