Multi-Layer Antenna Feed Via Structure for Wider mmWave Bandwidth
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Solution Overview
Problem
Current mmWave 5G antenna modules for mobile devices face challenges in downsizing while maintaining antenna performance, as reducing the size leads to deteriorated gain and bandwidth.
Innovation Solution
The design incorporates a feed via with a third insulating layer of lower permittivity and varying width, which increases the path length and coupling size with the antenna patch, enhancing bandwidth without increasing the antenna's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the antenna module is decreased, then the antenna module can be integrated into slimmer mobile devices, but antenna performance such as gain and bandwidth deteriorates
Solution Approach 1:
The patent applies local quality by creating a feed via with non-uniform width distribution - the third portion has a wider width than the first and second portions. This localized structural variation concentrates electromagnetic energy at critical coupling points without increasing the overall antenna module size, thereby maintaining performance while achieving downsizing.
Solution Approach 2:
The patent changes geometric parameters of the feed via structure by varying the width of different portions. Specifically, the third portion's width is increased relative to other portions, which modifies the electromagnetic field distribution and coupling characteristics, enabling improved bandwidth and gain within a compact form factor.
2Volume of moving object
If the size of the antenna module is decreased, then downsizing is achieved, but bandwidth deteriorates
Solution Approach 1:
The feed via's third portion is designed with locally enhanced width to strengthen the coupling between antenna elements. This localized structural optimization increases bandwidth by improving energy transfer efficiency at the coupling interface, without requiring an increase in the overall antenna module dimensions.
Solution Approach 2:
The patent utilizes the vertical dimension by creating a multi-layer insulating structure with the feed via passing through multiple insulating layers. The width variation in the third portion along the height direction provides an additional degree of freedom for bandwidth optimization independent of the planar footprint, enabling bandwidth enhancement without increasing surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively widens the bandwidth of the antenna without adding separate coupling patterns, addressing the size-performance tradeoff in mmWave 5G antenna modules.
Implementation Method 1
a permittivity of the third insulating layer is lower than a permittivity of the first insulating layer and a permittivity of the second insulating layer
Data Source
AI summary
An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.