Multilayer Antenna Module Impedance Adjustment via Feed Wire Positioning
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Solution Overview
Problem
Current antenna modules face challenges in efficiently transmitting and receiving signals across multiple frequency bands, particularly in the 5G communication system, where the increasing demand for wireless communication and higher frequencies necessitate improved antenna performance.
Innovation Solution
The antenna module incorporates a dielectric substrate with a multilayer structure, a feed element, a parasitic element, and a feed wire that penetrates through the parasitic element, allowing for individual adjustment of impedance at different frequency bands by shifting the connection positions of the feed wire, enabling effective signal transmission and reception across multiple frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a parasitic element is added to widen the frequency band, then the frequency band coverage is improved, but the device complexity increases
Solution Approach 1:
The patent combines the feed element and parasitic element into a single integrated antenna module structure, where both elements are mounted on the same dielectric substrate and share common grounding. This merging approach achieves wide frequency band coverage through the collaborative radiation of both elements while avoiding the complexity of separate antenna systems.
Solution Approach 2:
The antenna module is designed to operate across multiple frequency bands (sub-6GHz and millimeter-wave bands) using the same physical structure. The feed element and parasitic element work together to provide universal communication functionality across different 5G frequency ranges, eliminating the need for separate antenna systems for different bands.
2Reliability
If the feed wire connection positions are shifted to adjust impedance, then the impedance matching is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent adjusts the connection positions of the feed wire on the feed element as a design parameter to achieve proper impedance matching. By carefully selecting the first and second connection positions, the antenna module achieves optimal impedance characteristics across different frequency bands without requiring excessive manufacturing precision.
Solution Approach 2:
The parasitic element acts as an intermediary that facilitates impedance matching between the feed element and the transmission system. The feed wire connects to both the feed element and parasitic element at specific positions, and this intermediate connection structure helps achieve proper impedance matching while providing design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for wider frequency band operation by adjusting the impedance of both the feed and parasitic elements, enhancing communication speed and quality by optimizing signal radiation characteristics.
Implementation Method 1
The parasitic element is not supplied with power from a radio frequency semiconductor device and is electromagnetically coupled to a feed element
Implementation Method 2
The first feed wire penetrates through the parasitic element, and supplies radio frequency power to the feed element
Data Source
AI summary
The antenna module includes a dielectric substrate having a multilayer structure, a feed element to which radio frequency power is supplied, a ground electrode (GND), a parasitic element disposed in a layer between the feed element and the ground electrode (GND), and a feed wire. The feed wire penetrates through the parasitic element, and supplies radio frequency power to the feed element. When the antenna module is viewed in a plan view from a normal direction of the dielectric substrate, at least part of the feed element overlaps with the parasitic element, and a first position (P1) at which the feed wire is connected to the feed element is different from a second position (P2) at which the feed wire reaches the layer in which the parasitic element is disposed from a side of the ground electrode (GND).