Antenna Filter Sub-PCB Bumper for Compact 5G RF Modules
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Solution Overview
Problem
The increasing number of antennas and RF components in 5G communication systems leads to a larger filter board area and a risk of cracking due to differences in coefficient of thermal expansion (CTE) between filter and filter board, necessitating a solution to minimize board area and prevent cracking.
Innovation Solution
Implementing a passive circuit on a sub-printed circuit board (PCB) as a bumper between the filter board and RF filter, which also functions as a cushion to reduce the filter board area and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple RF filters are disposed on a filter board to support 5G communication systems with increasing number of antennas, then the filtering capability is improved, but the filter board area increases and the risk of cracking due to CTE differences increases
Solution Approach 1:
The patent divides the filter board into multiple separate filter modules, each containing one or more RF filters mounted on individual PCBs. These modular filter units are then connected to the main board through connectors, allowing the system to support multiple frequency bands without requiring a large integrated filter board area.
Solution Approach 2:
The patent transitions from a two-dimensional layout of filters on a single board to a three-dimensional modular architecture where filter modules are stacked or arranged vertically/dimensionally separated from the main board, reducing the footprint area while maintaining filtering capability.
2Adaptability or versatility
If multiple RF filters are disposed on a filter board to support 5G communication systems with increasing number of antennas, then the filtering capability is improved, but the risk of cracking due to differences in coefficient of thermal expansion (CTE) between filter and filter board increases
Solution Approach 1:
By segmenting the filter board into separate filter modules with individual PCBs, the patent isolates the CTE mismatch issue to small, manageable connections rather than large-area bonded interfaces, reducing stress concentration and cracking risk.
Solution Approach 2:
The patent introduces flexible circuits, connectors, or intermediate mounting structures between the RF filters and the main board that can accommodate thermal expansion differences, acting as a mediator that absorbs stress and prevents cracking during thermal cycling.
3Area of stationary object
If a sub-PCB is coupled to the filter to operate as a bumper, then the filter board area is reduced and cracking risk is minimized, but the device complexity increases
Solution Approach 1:
The sub-PCB bumper serves multiple functions simultaneously: it acts as a mechanical cushion to prevent cracking, provides a mounting platform for passive circuits, enables electrical connections, and reduces overall board area. This multi-functionality justifies the added complexity by consolidating several components into one element.
Solution Approach 2:
The patent merges the mechanical support function (bumper), the circuit board function, and the passive circuit host into a single integrated sub-PCB assembly, reducing the total number of separate components and simplifying the overall structure despite the increased functional density.
Data Source
AI summary
The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than a 4th generation (4G) communication system, such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a filter for filtering a radio frequency (RF) signal, and a sub printed circuit board (PCB), the sub-PCB comprises a passive circuit for processing the RF signal, and, the sub-PCB may be coupled to the filter such that the filter operates as a bumper when being coupled to a filter board.