Antenna Module PCB Grid Array for Low-Loss 5G Feeding
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Solution Overview
Problem
Existing antenna structures in wireless communication systems face challenges in reducing signal transmission loss and improving performance, particularly in 5G systems operating at higher frequencies, due to increased complexity and number of antenna elements, which complicates assembly and increases manufacturing costs.
Innovation Solution
An antenna module with a grid array connection between an antenna board and a main board, featuring a feeding line on the antenna board or an air layer, reduces signal loss by direct interconnection and minimizes dielectric loss through an air-based feed structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional antenna structures are used in 5G systems, then communication performance can be maintained, but signal transmission loss increases and manufacturing complexity increases
Solution Approach 1:
The antenna system is divided into multiple antenna elements arranged in arrays, with each element independently connected to the main board through grid arrays. This segmentation allows for reduced signal loss in each individual path while maintaining overall system performance through modular construction.
Solution Approach 2:
The patent transitions from planar feeding structures to three-dimensional air-based feeding lines that extend vertically between the antenna board and main board. This dimensional change reduces dielectric loss by minimizing contact with lossy substrate materials while maintaining electrical connection.
2Productivity
If the number of antenna elements is increased to improve communication performance, then data rate increases, but manufacturing cost and assembly complexity increase
Solution Approach 1:
The grid array structure serves multiple functions simultaneously: it provides electrical connection between antenna elements and the main board, establishes precise spatial positioning for multiple antenna elements, and enables modular assembly. This universal structure allows scalable deployment from 4 to 64 or more antenna elements without requiring different connection methodologies.
Solution Approach 2:
The antenna board is pre-assembled with multiple antenna elements and grid array connections before being integrated with the main board. This preliminary assembly allows for standardized manufacturing of antenna sub-arrays that can be scaled and configured flexibly, reducing overall system assembly complexity.
3Ease of manufacture
If feeding lines are disposed on substrate layers, then manufacturing is simplified, but dielectric loss increases
Solution Approach 1:
Air serves as an intermediary medium between the antenna board and main board, replacing traditional dielectric substrate materials in the feeding path. The grid array structures act as intermediate connectors that bridge the air-based feeding lines, maintaining electrical connection while minimizing dielectric loss through reduced substrate contact.
Data Source
AI summary
An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.