Antenna Ground Extension Structure for Compact PCB Modules

The patent extends the ground in the vertical dimension by stacking multiple ground patterns on different layers of the PCB. The first ground pattern is on a first layer, the second ground pattern is on a second layer, and they are electrically connected through via holes, creating a three-dimensional ground structure that increases effective ground area without increasing PCB footprint.

The patent nests multiple ground patterns within the same PCB footprint by utilizing different layers. The first ground pattern and second ground pattern are nested vertically, with the second ground pattern positioned to overlap or align with the first ground pattern, maximizing ground area within the constrained horizontal space.

The patent transitions from a two-dimensional ground layout to a three-dimensional ground structure by stacking ground patterns on multiple PCB layers. This vertical expansion increases the effective ground area while maintaining the same horizontal footprint, thereby preventing antenna module enlargement.

The patent divides the ground into multiple segmented ground patterns located on different PCB layers. The first ground pattern on the first layer and the second ground pattern on the second layer are connected through via holes, creating a segmented multi-layer ground structure that provides large effective ground area within compact dimensions.

The patent compensates for the small ground size on each individual layer by stacking multiple ground patterns vertically. The first ground pattern and second ground pattern on different layers, when electrically connected, create an equivalent large ground structure that maintains antenna performance despite the compact horizontal footprint.

The patent merges multiple ground patterns from different PCB layers into a unified ground structure through electrical connections via via holes. This combined multi-layer ground structure provides the equivalent effect of a large single-layer ground, ensuring antenna performance is maintained while keeping the antenna module compact.

The patent enables radiation pattern adjustment by distributing ground patterns across multiple vertical layers. The first ground pattern and second ground pattern on different layers can be independently configured and connected, providing additional degrees of freedom for optimizing radiation patterns in three-dimensional space rather than being constrained to a single plane.

The patent creates a flexible multi-layer ground structure where the configuration of ground patterns on different layers can be adjusted to optimize radiation patterns. The via holes providing electrical connections between layers allow for dynamic reconfiguration of the ground structure to achieve desired radiation characteristics in different operating conditions.