Antenna Ground Contact Heat Dissipation in Compact Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices, particularly portable ones like smartphones, face heat dissipation challenges due to high integration and compact designs, leading to performance deterioration and potential malfunctions as heat is concentrated on the rear surface, affecting the broadband antenna and conductive pattern portions.
Innovation Solution
A heat dissipation structure is implemented within the electronic device, featuring a non-conductive supporting member with a conductive pattern portion and a heat dissipation member that extends to overlap the broadband antenna, allowing for efficient heat diffusion from electrical components, eliminating the need for additional space and enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high integration and compact design are applied to electronic devices, then device size is reduced and functionality is increased, but heat generation density increases and heat dissipation becomes difficult
Solution Approach 1:
The patent introduces a three-dimensional heat dissipation structure with vertical stacking of components (conductive pattern portion, heat dissipation member, antenna) to distribute heat in the Z-direction. The heat dissipation member extends vertically to contact both the conductive pattern portion above and the antenna below, creating a multi-layer heat conduction path that utilizes the third dimension for heat management in a compact footprint.
Solution Approach 2:
The heat dissipation member serves as an intermediary component between the heat-generating conductive pattern portion and the antenna structure. It transfers heat from the conductive pattern portion to the antenna, which acts as a heat sink, thereby mediating the heat transfer process and enabling efficient heat dissipation without requiring additional external heat sinks or cooling mechanisms.
2Temperature
If heat dissipation structures are added to reduce temperature, then heat dissipation performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The antenna structure serves multiple functions: it performs its primary wireless communication function while simultaneously acting as a heat dissipation component. The conductive pattern portion also serves dual purposes by generating electromagnetic fields for communication and generating heat that is then dissipated through the heat dissipation member. This multi-functionality reduces the need for separate dedicated heat dissipation components.
Solution Approach 2:
The patent merges the heat dissipation function with the existing antenna structure by having the heat dissipation member contact the antenna. This combination integrates two functions (heat dissipation and wireless communication) into a single structural arrangement, reducing overall device complexity compared to having separate heat dissipation and antenna systems.
3Reliability
If conductive pattern portion and broadband antenna are designed with different stack structures, then each component can be optimized for its function, but manufacturing processes become more difficult
Solution Approach 1:
The patent divides the device into distinct functional areas on the supporting member: a first area for the conductive pattern portion, a second area for the broadband antenna, and a third area connecting them. This segmentation allows each component to be optimized independently for its specific function while maintaining a unified manufacturing approach through the common supporting member structure.
Solution Approach 2:
The supporting member acts as an intermediary platform that accommodates both the conductive pattern portion and the broadband antenna with their different stack structures. It provides a common base that facilitates the integration of differently structured components, enabling them to be manufactured together as a unified assembly while preserving their individual optimization.
4Volume of moving object
If electrical components are disposed to overlap the broadband antenna, then space utilization is improved, but heat concentration on the rear surface increases and performance deteriorates
Solution Approach 1:
The heat dissipation member serves as an intermediary that intercepts heat from the conductive pattern portion before it can concentrate on the rear surface. By providing a direct thermal conduction path to the antenna, it prevents heat accumulation in the rear surface area, enabling safe overlapping of components for improved space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the temperature gap between the front and rear surfaces of the device, improving heat dissipation and maintaining performance by allowing heat generated from electrical components to be quickly diffused, thus enhancing the overall efficiency of the electronic device's internal space utilization.
Implementation Method 1
a heat dissipation member extending from the first area to the third area, and the ground portion of the antenna extending from the second area to the third area to contact at least a portion of the heat dissipation member
Data Source
AI summary
According to various embodiments of the disclosure, an electronic device may include a housing, a non-conductive supporting member disposed in the housing and including a first area, a second area spaced apart from the first area, and a third area connecting the first area and the second area, a conductive pattern portion disposed over the first area of the supporting member, a heat dissipation member disposed to at least partially overlap the conductive pattern portion, and an antenna including a circuit board, a conductive portion, and a ground portion. The conductive portion of the antenna may be disposed over the second area. The heat dissipation member may extend from the first area to the third area, and the ground portion of the antenna may extend from the second area to the third area to contact at least a portion of the heat dissipation member.