Antenna Package Ground Layout for Low-Loss Display Signal Transmission
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Solution Overview
Problem
Existing antenna designs for image display devices face challenges in maintaining signal integrity and reducing signal loss as the driving frequency increases, particularly due to interactions with intermediate circuit structures like flexible printed circuit boards (FPCBs).
Innovation Solution
The proposed antenna package includes an antenna unit with a radiator, transmission line, and antenna ground pad, combined with a circuit board featuring a core layer, circuit wiring layer, and ground layer. The circuit board's ground layer is strategically positioned to avoid overlapping with the non-bonding region of the antenna ground pad, reducing radiation disturbance and enhancing horizontal radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an intermediate circuit structure such as FPCB is used to electrically connect the driving integrated circuit chip and the antenna, then electrical connection is achieved, but additional signal loss and signal disturbance occur
Solution Approach 1:
The patent extracts and removes the intermediate FPCB structure from the signal path between the antenna and driving circuit. By directly mounting the integrated circuit chip on the antenna substrate, the harmful intermediate circuit structure is eliminated, preventing signal disturbance from FPCB wirings and electrodes while maintaining electrical connection functionality
Solution Approach 2:
The patent merges the antenna substrate and circuit board into a single integrated structure. The antenna unit is directly combined with the circuit board carrying the driving integrated circuit chip, eliminating the separate FPCB connection layer and reducing the transmission path, thereby minimizing signal loss and disturbance
2Reliability
If the ground layer overlaps the antenna ground pad, then grounding connection is improved, but radiation disturbance occurs and horizontal radiation efficiency decreases
Solution Approach 1:
The patent applies local quality by creating different grounding conditions in different regions of the antenna ground pad. The bonding region maintains ground layer overlap for electrical connection, while the non-bonding region excludes the ground layer to prevent radiation disturbance. This spatially differentiated grounding approach optimizes both grounding performance and radiation characteristics
Solution Approach 2:
The antenna ground pad is segmented into distinct bonding and non-bonding regions. This segmentation allows the ground layer to be selectively positioned - overlapping in the bonding region for connection purposes and non-overlapping in the non-bonding region for radiation performance, thereby resolving the contradiction between grounding and radiation disturbance
3Speed
If the driving frequency of the antenna is increased, then communication capability is improved, but signal loss increases
Solution Approach 1:
The patent converts the potential harm of high-frequency operation (increased signal loss) into a benefit by optimizing the transmission path. By eliminating intermediate FPCB structures and reducing the transmission distance between the antenna and driving circuit, the design makes the most of high-frequency operation, allowing the antenna to operate at higher frequencies with minimized signal loss through direct electrical connection
Data Source
AI summary
An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.