Antenna Part Grounding Conductive Frame to AC Substrate
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Solution Overview
Problem
Existing electronic devices with conductive frames face challenges in grounding due to separate physical structures required for connecting the conductive frames to the substrate, which increases assembly complexity and manufacturing costs, and can lead to electric shock issues during charging.
Innovation Solution
An electronic device configuration that uses an antenna part with an integrated antenna radiator to electrically connect the conductive frame to the substrate's AC ground, eliminating the need for a separate connecting body and reducing assembly space and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate connecting body is used to electrically connect the conductive frame to the substrate, then the grounding function is achieved, but the device complexity and assembly space increase
Solution Approach 1:
The patent combines the antenna part and the connecting body into a single integrated structure. The antenna part directly serves as the connecting body to electrically connect the conductive frame to the substrate, eliminating the need for separate connecting components. This merging reduces device complexity while maintaining the grounding function.
Solution Approach 2:
The antenna part is designed to perform multiple functions: it serves as both the antenna radiator for wireless communication and as the connecting body for electrical grounding of the conductive frame. This multi-functionality reduces the number of components needed while achieving both communication and grounding objectives.
2Reliability
If a separate connecting body is provided for grounding, then the conductive frame can be grounded, but the manufacturing cost increases
Solution Approach 1:
By merging the antenna part and connecting body into one component, the patent reduces the total number of parts that need to be manufactured and assembled. This consolidation lowers manufacturing costs while maintaining the grounding capability through the integrated structure.
3Reliability
If the conductive frame is electrically connected to the DC ground, then grounding is achieved, but electric shock risk occurs during charging
Solution Approach 1:
The patent segments the grounding system into two separate grounds: AC ground for the antenna part (and thus the conductive frame) and DC ground for the battery charging circuit. This segmentation isolates the RF grounding path from the power charging path, preventing electric shock during charging while maintaining proper grounding for antenna operation.
Solution Approach 2:
The antenna part serves as an intermediary element that provides the grounding path for the conductive frame to the AC ground, while the DC ground remains separate for charging operations. This intermediary structure enables selective grounding that prevents harmful electric shock during charging.
Data Source
AI summary
An electronic device includes a substrate, a structure arranged near the substrate and includes at least one electronic component, a conductive structure provided in the electronic device, and a conductor arranged in the structure, grounding the conductive structure to a ground of the substrate. Electronic components spaced within the electronic device are electrically connected to each other using the existing structure to be installed, so that a mounting space for preparing an electrical connector is prevented from being wasted, thereby making the electronic device slim. The embodiments according to the present disclosure can reduce the number of assembling processes and manufacturing costs.