Thermal Diffusion Structure for Side-Mounted Antenna Heat
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Solution Overview
Problem
Conventional antenna modules for high-speed data communication generate excess heat, which is difficult to dissipate due to limited space on the side surfaces of electronic devices, necessitating design changes to accommodate heat emission structures.
Innovation Solution
A thermal diffusion structure is implemented within the electronic device, comprising a housing with a display, a battery, and a thermal diffusion member that includes a fluid and a conductor plate connected to a heat pipe to efficiently diffuse and emit heat generated by the antenna module, minimizing the mounting space required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat emission structure is applied to the side surface of the electronic device, then heat dissipation is improved, but the device design must be changed to secure additional mounting space
Solution Approach 1:
The thermal diffusion member is integrated with the existing battery space and housing structure, merging the heat dissipation function with the structural components of the device. This eliminates the need for separate heat emission structures and additional mounting space on the side surface.
Solution Approach 2:
The thermal diffusion member serves multiple functions: it diffuses heat from the antenna module, utilizes the battery space for thermal management, and maintains the structural integrity of the housing. This multi-functionality reduces the need for additional components and design changes.
2Temperature
If a conventional heat emission structure is applied to the side surface of the electronic device, then heat dissipation is improved, but the device size increases
Solution Approach 1:
The thermal diffusion member is nested within the existing device structure, specifically utilizing the space between the antenna module and the battery. This nesting approach allows heat dissipation without increasing the external dimensions of the device.
Solution Approach 2:
Instead of extending the heat emission structure to the side surface (horizontal dimension), the thermal diffusion member operates within the vertical space between components, utilizing the Z-axis dimension for heat diffusion without increasing the device's footprint.
3Speed
If the antenna module is mounted on the side surface of the electronic device, then high-speed data communication is enabled, but space for heat emission structure is reduced
Solution Approach 1:
The thermal diffusion member acts as an intermediary between the antenna module and the battery, transferring heat from the antenna module through the battery space to the housing. This mediator approach enables heat dissipation without requiring additional space on the side surface.
4Speed
If the antenna module generates excess heat, then high-speed data communication performance is improved, but heat dissipation becomes difficult
Solution Approach 1:
The thermal diffusion member converts the harmful heat generated by the antenna module into a manageable thermal flow path, utilizing the battery space as a heat sink and the housing as a heat dissipation surface. This transforms the heat problem into an integrated thermal management solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal diffusion structure effectively diffuses heat, maintaining stable high-speed data communication while reducing the need for design changes and preventing increases in device size, thus ensuring efficient heat management and performance.
Implementation Method 1
The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion
Implementation Method 2
The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source
Data Source
AI summary
Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.