5G Mobile Terminal Antenna Heat Dissipation Structure

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Solution Overview

Problem

In 5G antenna structures, the adjacent placement of integrated circuits (ICs) and antennas for improved heat dissipation leads to radiation interference, as conventional heat dissipation methods block the antenna's radiation.

Innovation Solution

A heat dissipation structure combining a graphite or metal heat dissipation sheet with a dielectric material, such as aluminum nitride or boron nitride, is used, where the heat dissipation sheet is partially removed to form an opening over the antenna, allowing radiation to pass through while maintaining effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipation sheet is disposed to cover the IC in 5G antenna structure, then heat dissipation performance is improved, but the antenna radiation is blocked

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidantenna radiation blocking
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The heat dissipation sheet is segmented by forming openings at specific positions corresponding to the antenna elements. This segmentation allows the heat dissipation sheet to cover the IC for heat dissipation while creating radiation paths for the antenna elements to function without blocking

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation sheet has different properties at different locations: areas covering the IC provide heat dissipation function, while areas with openings at antenna element positions provide radiation transmission function. This local differentiation resolves the contradiction between heat dissipation and radiation blocking

Inventive Principle:
Principle #3Local quality

2Loss of energy

If IC and antenna are arranged adjacent to each other, then path loss is reduced, but heat dissipation becomes difficult without blocking antenna radiation

Engineering Contradiction:
Improvepath lossVSAvoidheat dissipation
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The heat dissipation sheet is divided into functional zones through openings, allowing simultaneous achievement of adjacent IC-antenna arrangement for reduced path loss and effective heat dissipation through the segmented structure that doesn't block radiation

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation sheet acts as an intermediary component between the IC and the external environment, with strategically positioned openings that mediate between the need for heat dissipation from the IC and the need for unobstructed radiation from the adjacent antenna elements

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient heat dissipation without obstructing the antenna's radiation, enhancing the performance of both heat dissipation and antenna functionality in 5G mobile terminals.

Implementation Method 1

a heat dissipation sheet attached to an inner surface of the base to dissipate heat generated in the IC

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a dielectric disposed to cover the opening and formed of a dielectric material to allow radio signals from the patch antennas to be radiated to the outside of the case

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS10566675B2Mobile terminal
Publication Date: 2020.02.18 LG ELECTRONICS INC
  • US10566675B2 patent drawing
  • US10566675B2 patent drawing
  • US10566675B2 patent drawing

AI summary

A mobile terminal includes patch antennas forming an array, an integrated circuit (IC) controlling transmission and reception of radio signals of the patch antennas, and a case disposed to cover the IC, wherein the case includes: a base forming an appearance, a heat dissipation sheet attached to an inner surface of the base to dissipate heat generated in the IC and having an opening corresponding to the patch antennas, and a dielectric disposed to cover the opening and formed of a dielectric material to allow radio signals from the patch antennas to be radiated to the outside of the case.