Antenna Module Heat Transfer Structure for Compact Electronics
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Solution Overview
Problem
Electronic devices, especially those designed for portability, face challenges in managing heat generated by advanced components, which can lead to reduced performance and increased risk of low-temperature burns due to self-heating, and lack effective cooling solutions like mechanical fans.
Innovation Solution
An electronic device design incorporating a housing with a heat dissipation member connected to electronic components, featuring an antenna module disposed adjacent or within a side structure that is inclined or perpendicular to the housing plates, and a fixing member with thermally conductive materials to transfer heat from the antenna module to the heat dissipation member, dispersing it effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If advanced electronic components are integrated and miniaturized to improve device performance, then device functionality and performance are improved, but heat generation increases and cooling becomes more difficult
Solution Approach 1:
The patent combines the antenna module's structural support function with heat dissipation function by making the fixing member that holds the antenna module also serve as a heat transfer path. The fixing member is thermally coupled to both the antenna module (which generates heat) and the heat dissipation member, thereby merging mechanical support and thermal management functions into a single component.
Solution Approach 2:
The fixing member serves multiple functions: it mechanically supports and positions the antenna module while simultaneously acting as a heat transfer component. By integrating heat dissipation capability into the fixing member, the design achieves multi-functionality without adding separate cooling structures, thus managing heat from miniaturized components effectively.
2Temperature
If mechanical cooling devices like fans are used to improve heat dissipation, then cooling effectiveness is improved, but device portability and compactness are reduced
Solution Approach 1:
The patent extracts the heat dissipation function from traditional mechanical cooling systems (fans) and implements it through passive thermal conduction pathways. By using the fixing member and heat dissipation member to conduct heat away from the antenna module without requiring active mechanical components, the design achieves effective cooling while maintaining device portability and compactness.
Solution Approach 2:
The patent replaces the mechanical cooling system (fans, pumps) with a thermal conduction-based passive cooling system. The fixing member and heat dissipation member create a thermal pathway that conducts heat away from the antenna module without requiring mechanical motion, thereby eliminating the need for heavy mechanical cooling devices while maintaining cooling effectiveness.
3Reliability
If heat dissipation structures are added to manage thermal energy, then operating stability is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation structure with the existing antenna module support structure. The fixing member that is already required to hold the antenna module in place is also designed to provide thermal conduction pathways to the heat dissipation member. This integration avoids adding separate, independent heat dissipation components, thereby managing complexity while improving operating stability.
4Volume of moving object
If electronic components are placed closer together to improve integration, then device miniaturization is improved, but heat concentration and thermal management difficulty increase
Solution Approach 1:
The patent applies local quality by providing targeted heat dissipation specifically at the antenna module location where heat is generated. The fixing member creates a localized thermal management solution for the antenna module without requiring global cooling system changes. This localized approach effectively manages heat concentration in the specific area of high heat generation while maintaining overall device miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures a stable operating environment by preventing heat concentration, improving power efficiency, and mitigating the risk of low-temperature burns by efficiently dissipating heat generated by self-heating components.
Implementation Method 1
a heat dissipation member connected to electronic components including a processor and/or a communication module in the housing, wherein the heat dissipation member is configured to diffuse heat generated by the electronic components
Implementation Method 2
a fixing member with thermally conductive materials to transfer heat from the antenna module to the heat dissipation member
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate, a heat dissipation member accommodated inside the housing, at least one antenna module disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna module being disposed to be inclined or perpendicular relative to the front plate or the rear plate, and a fixing member coupled to and at least partially surrounding the antenna module. The fixing member may include a first heat transfer portion at least partially surrounding a rear face of the antenna module, and a second heat transfer portion disposed in contact with the heat dissipation member.