Antenna Heating Element for RFID Adhesive Curing
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Solution Overview
Problem
The serial assembly line process for RFID devices is bottlenecked by the curing of adhesive, which requires heating components that do not need to be heated, prolonging the assembly time and reducing throughput.
Innovation Solution
An antenna structure with a heating element located between its ends, electrically separate from the antenna, is used to directly apply heat to the adhesive, reducing curing time by eliminating the need to heat other components like the IC device or substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional heating components are used to cure adhesive in serial assembly line, then adhesive curing is achieved, but assembly time is prolonged and throughput is reduced due to heating components that do not need to be heated
Solution Approach 1:
The heating element is positioned specifically between the first and second ends of the antenna, localized directly at the adhesive application site. This localized heating approach ensures that only the adhesive and immediate surrounding components are heated, rather than heating the entire antenna structure, IC device, or substrate. The heating element's strategic placement enables targeted thermal energy delivery to the bonding interface, reducing curing time while avoiding unnecessary heating of other components.
2Reliability
If heating components are used to cure adhesive, then adhesive bonding is achieved, but energy is wasted heating components that do not need to be heated
Solution Approach 1:
The heating element is positioned specifically between the first and second ends of the antenna, localized directly at the adhesive application site. This localized heating approach ensures that only the adhesive and immediate surrounding components are heated, rather than heating the entire antenna structure, IC device, or substrate. The heating element's strategic placement enables targeted thermal energy delivery to the bonding interface, reducing curing time while avoiding unnecessary heating of other components.
3Productivity
If adhesive curing is performed in serial assembly line, then RFID devices are assembled, but the process is bottlenecked by curing time
Solution Approach 1:
The heating element is positioned specifically between the first and second ends of the antenna, localized directly at the adhesive application site. This localized heating approach ensures that only the adhesive and immediate surrounding components are heated, rather than heating the entire antenna structure, IC device, or substrate. The heating element's strategic placement enables targeted thermal energy delivery to the bonding interface, reducing curing time while avoiding unnecessary heating of other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach expedites the assembly process by directly delivering heat to the adhesive, thereby increasing throughput and reducing the time required for curing the adhesive.
Implementation Method 1
applying a trigger to the heating element to cause the heating element to become heated
Data Source
AI summary
An antenna structure is disclosed. In the embodiment, the antenna structure includes a substrate and an antenna that is formed on the substrate, the antenna having a first end and a second end that are separated. The antenna structure also includes a heating element formed on the substrate with at least a portion of the heating element being located in the separation between the first and second ends of the antenna, with the heating element being electrically separate from the antenna.