Antenna Structure With Indirect Metal Patterns For Bandwidth And Warpage
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Solution Overview
Problem
Existing electronic devices face challenges in increasing bandwidth, reducing warpage, and improving reliability, particularly in thin and lightweight designs where traditional manufacturing methods may lead to resonant frequency shifts and electromagnetic interference.
Innovation Solution
The electronic device comprises an antenna structure with multiple dielectric and metal patterns, a circuit structure with conductive layers and pads, and a chip, where the metal patterns emit different frequency bands and are indirectly connected, along with a manufacturing method that includes thermal compression and adhesive bonding to reduce warpage and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If traditional manufacturing methods are used for thin and lightweight electronic devices, then device thickness and weight are reduced, but warpage and resonant frequency shifts occur
Solution Approach 1:
The antenna structure is divided into multiple independent metal patterns (first metal pattern, second metal pattern, third metal pattern) disposed at different locations and orientations. Each metal pattern operates at different frequency bands, segmenting the electromagnetic radiation function to reduce mutual interference and minimize warpage-induced frequency shifts.
Solution Approach 2:
The patent employs multiple metal patterns with different geometric parameters (sizes, shapes, orientations) to operate at different frequency bands. By changing the physical parameters of each metal pattern, the system achieves broadband operation while maintaining frequency stability despite thermal expansion or mechanical warpage.
2Adaptability or versatility
If multiple metal patterns are used to increase bandwidth, then frequency coverage is improved, but device complexity increases
Solution Approach 1:
Multiple metal patterns are integrated into a single antenna structure that serves multiple functions: each metal pattern radiates at different frequency bands, collectively providing broadband coverage. The shared ground structure and substrate provide common support, reducing overall device complexity despite the multi-functional requirement.
Solution Approach 2:
The patent merges multiple antenna elements (different metal patterns) into a unified antenna structure with a common ground and substrate. This combination achieves broadband operation through constructive interference and impedance matching, while the integrated design reduces the total complexity compared to separate antenna systems.
3Ease of manufacture
If metal patterns are directly connected for electrical connection, then manufacturing is simplified, but electromagnetic interference increases
Solution Approach 1:
A ground structure serves as an intermediary between different metal patterns, providing electrical connection while isolating their electromagnetic fields. The ground plane acts as a shield and reference, enabling indirect connection that reduces mutual interference between metal patterns operating at different frequencies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases bandwidth by emitting electromagnetic waves across different frequency bands and reduces warpage and resonant frequency shifts, thereby improving the reliability and performance of the electronic device.
Implementation Method 1
the first metal pattern and the second metal pattern may respectively emit electromagnetic waves of different frequency bands
Implementation Method 2
The antenna structure and the first circuit structure are bonded
Implementation Method 3
along with a manufacturing method that includes thermal compression and adhesive bonding
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The electronic device includes an antenna structure, a first circuit structure, and a chip. The antenna structure includes a first dielectric layer, a first metal pattern, a second dielectric layer, and a second metal pattern. The first dielectric layer has a first surface and a second surface. The first metal pattern is disposed on the first surface. The second dielectric layer is disposed on the first metal pattern. The second metal pattern is disposed on the second dielectric layer. The first circuit structure is disposed on the antenna structure, and includes a third dielectric layer, a first conductive layer, and a first pad. The third dielectric layer is disposed on the second surface and has a fourth surface away from the second surface. The first conductive layer is disposed on the fourth surface. The first pad is disposed on the first conductive layer. The chip is disposed on the first circuit structure and electrically connected to the first circuit structure. The first metal pattern is indirectly electrically connected to the first conductive layer. The electronic device and the manufacturing method thereof may increase a bandwidth, reduce warpage, or improve reliability.