Antenna Assembly With Integrated Connector Channel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Internal antennas in wireless communication devices often suffer from stress-induced cracking and decreased electrical connection effectiveness due to deflection of molded connectors, which affects their performance and reliability.
Innovation Solution
An antenna assembly with a carriage layer and integrated connector featuring a channel with a conductive layer, providing a secure electrical connection between the antenna and the radio frequency power source, mitigating stress issues through a seamless conductive layer formed using methods like laser direct structuring or two-shot molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If molded connectors are used to connect the antenna to the radio frequency power source, then the antenna assembly can be manufactured using standard molding techniques, but the connectors are prone to stress-induced cracking and deflection that decreases electrical connection effectiveness
Solution Approach 1:
The patent merges the connector structure with the conductive layer by forming the conductive layer directly within the molded connector housing. The conductive layer is integrated into the connector body through co-molding or insert molding techniques, creating a unified structure where the connector and conductive path become a single integrated component rather than separate parts that can disconnect or crack independently.
Solution Approach 2:
The patent employs composite construction by combining the molded connector material (typically plastic or polymer) with a conductive material (such as metal or conductive polymer) to create a hybrid connector assembly. This composite structure allows the non-conductive portion to provide mechanical support and stress relief while the conductive portion maintains electrical integrity, resolving the contradiction between ease of molding and connection reliability.
2Loss of substance
If the conductive layer is made thin to reduce material usage and cost, then manufacturing costs decrease, but the conductive layer becomes more susceptible to cracking under stress
Solution Approach 1:
The patent applies local quality by varying the thickness and material properties of the conductive layer in different regions. The conductive layer is made thicker or reinforced with additional conductive material in high-stress areas where cracking is most likely to occur, while maintaining thinner sections in low-stress regions to minimize overall material usage. This localized reinforcement strategy maintains electrical conductivity and mechanical strength where needed while optimizing material efficiency overall.
Data Source
AI summary
The present invention provides an antenna with an integral electrical connection to a printed circuit board. The electrical connection is accomplished by providing a connection beam from a conductive layer to the circuit board. The connection beam is provided with a channel extending through the connection beam, such as a channel through the geometric center of the beam, and the channel is plated. The connection beam terminates with a contact point. The beam is deflectable to provide contact force.